Ceramic Electronic Component Glass Accumulation Interface
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Solution Overview
Problem
The existing methods for forming external electrodes on ceramic electronic components, such as thermistors and laminated ceramic capacitors, result in defective plating due to excessive deposition of glass components on the electrode surfaces, leading to reduced mechanical strength and reliability, including increased risks of solder bursts and moisture resistance issues.
Innovation Solution
The formation of glass accumulations at the interfaces between external electrodes and the ceramic body, facilitated by columnar structures that accumulate glass components and reduce their deposition on the electrode surfaces, while promoting sufficient sintering of metal components, thereby enhancing the joint between internal and external electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If glass material is added to external electrode paste to accelerate sintering, then sintering speed increases, but glass components deposit excessively on external electrode surfaces causing defective plating
Solution Approach 1:
The patent introduces a glass accumulation layer with specific thickness (5-20 μm) at the interface between external electrode and ceramic body, creating non-uniform glass distribution. This local concentration of glass material at the interface promotes sintering where needed while preventing excessive glass deposition on the external electrode surface, thus resolving the contradiction between sintering speed and plating quality
Solution Approach 2:
The patent forms a glass accumulation layer beforehand at the external electrode-ceramic body interface before plating processes. This preliminary glass layer acts as a barrier and reservoir, controlling glass flow during sintering and preventing premature glass deposition on the external electrode surface, thereby enabling both rapid sintering and defect-free plating
2Strength
If glass components are deposited on external electrode surfaces to provide fixing strength, then mechanical strength increases, but plated layers are formed defectively on the surfaces
Solution Approach 1:
The patent creates a non-uniform glass distribution by forming a glass accumulation layer at the interface region with controlled thickness (5-20 μm). This localized glass concentration provides fixing strength at the critical interface between external electrode and ceramic body, while the external electrode surface remains free of excessive glass deposition, allowing defect-free plating
3Manufacturing precision
If conventional methods are used to suppress glass deposition on external electrode surfaces, then plating quality improves, but sintering of conductive particles becomes insufficient
Solution Approach 1:
The patent forms a glass accumulation layer at the external electrode-ceramic body interface before sintering and plating processes. This preliminary glass layer serves dual functions: it provides sufficient glass material at the interface for complete sintering of conductive particles, while simultaneously acting as a barrier that prevents glass from depositing on the external electrode surface, thereby achieving both adequate sintering and defect-free plating
4Manufacturing precision
If glass components are reduced between ceramic body and external electrode to prevent deposition, then plating quality improves, but mechanical strength and reliability decrease
Solution Approach 1:
The patent creates a non-uniform glass distribution with a glass accumulation layer of specific thickness (5-20 μm) at the interface between external electrode and ceramic body. This localized glass concentration ensures sufficient glass material for mechanical strength and reliability at the critical bonding interface, while preventing glass deposition on the external electrode surface, thereby achieving both defect-free plating and adequate mechanical strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses glass component deposition on external electrode surfaces, preventing defective plating and improving the mechanical strength and reliability of ceramic electronic components by reducing porosity and ensuring proper sintering of conductive particles.
Implementation Method 1
one of objects of adding the glass material to the external electrode paste is the acceleration of sintering for conductive particles through liquid-phase sintering with the use of softened glass during the baking treatment
Implementation Method 2
using a glass material that has a high softening point
Data Source
Figure 1~2
Figure 3~4
Figure 5(a)~5(c)
AI summary
Provided is a ceramic electronic component which suppresses deposition of glass components on external electrode surfaces, and keeps plated layers from being formed defectively. Provided is a ceramic electronic component which includes: a ceramic body; a first internal electrode provided in the ceramic body, and exposed at one end surface of the ceramic body; a second internal electrode provided in the ceramic body, and exposed at the other end surface of the ceramic body; a first external electrode provided on one end surface of the ceramic body and electrically connected to the first internal electrode; and a second external electrode provided on the other end surface of the ceramic body and electrically connected to the second internal electrode, and has, between the external electrode and the internal electrode, a columnar structure that provides electrical conduction at least between the external electrode and the internal electrode, and has, on both sides of the columnar structure, a glass accumulation formed in contact with the columnar structure.