Ceramic Electronic Component Grain Size Control for Electrode Peeling
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Solution Overview
Problem
Ceramic electronic components with reduced internal electrode thickness face issues of external electrode peeling due to decreased contact area, which affects their reliability and performance in high-frequency communication systems.
Innovation Solution
The ceramic electronic component design includes dielectric layers and internal electrode layers with specific grain size and distribution characteristics, along with external electrodes formed on a base layer, to enhance bonding and prevent peeling, with average crystal grain sizes of 200 nm or less and a CV value of grain size distribution less than 38% in the dielectric portions contacting the external electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thicknesses of the internal electrode layers are reduced to increase capacity, then the capacitance increases, but the contact area between internal electrode layers and external electrode decreases, resulting in peeling of the external electrode
Solution Approach 1:
The patent applies local quality by creating a dielectric portion with specific crystal grain size characteristics (200 nm or less average size and CV value less than 38%) in the region contacting the external electrode, while other regions can have different characteristics. This localized optimization of the dielectric structure enhances bonding strength at the critical interface without compromising overall capacitance
Solution Approach 2:
The patent changes physical parameters of the dielectric material, specifically controlling the crystal grain size distribution in the dielectric portion to have an average size of 200 nm or less and a CV value less than 38%. This parameter optimization improves the bonding characteristics between the dielectric and external electrode, preventing peeling while maintaining thin layer structures
2Quantity of substance
If the thicknesses of the dielectric layers and internal electrode layers are reduced to increase capacity, then the capacitance increases, but the structural integrity and bonding strength decrease
Solution Approach 1:
The patent creates a specialized dielectric portion with optimized crystal grain characteristics specifically at the bonding interface region. This local optimization ensures strong bonding strength where needed (at the external electrode contact area) while allowing other regions to maintain thin dimensions for high capacitance
Solution Approach 2:
The patent effectively creates a composite structure where the dielectric layer has non-uniform crystal grain distribution - with a dielectric portion having fine grains (≤200 nm) for strong bonding and other regions that can be optimized for capacitance. This composite approach allows simultaneous achievement of strong bonding and high capacitance in thin-layer structures
Data Source
AI summary
A ceramic electronic component includes a multilayer chip having a rectangular parallelepiped shape and including dielectric layers and internal electrode layers alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip opposite to each other, and external electrodes respectively formed on the two edge faces, wherein an average crystal grain size of the ceramic in a cross section is 200 nm or less in a dielectric portion, and a CV value of a grain size distribution of crystal grains of the ceramic in the cross section is less than 38% in the dielectric portion, the dielectric portion being defined as a region made of the ceramic in the multilayer chip that is in contact with one of the external electrodes and that has a width of 5 μm from said one of the external electrodes.