Ceramic Electronic Component Inkjet Printing
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Solution Overview
Problem
Conventional methods for producing multilayer ceramic electronic components face challenges in downsizing, handling, and reducing chip chipping, particularly due to limitations in processing small-sized green sheets and the need for precise handling mechanisms, which increase costs and reduce productivity.
Innovation Solution
A method involving the use of non-contact-type printing devices like ink-jet printers to form ceramic and internal electrode patterns with circular or elliptical shapes, allowing for the creation of thin ceramic layers and internal electrodes without contact-type printing methods, enabling efficient production of small-sized ceramic electronic components with improved handling characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional contact-type printing methods are used to form ceramic patterns, then manufacturing precision can be maintained, but device complexity increases and productivity decreases due to the need for lamination machines and precise handling mechanisms
Solution Approach 1:
The patent replaces mechanical contact-type printing methods with non-contact inkjet printing technology. The inkjet printing device deposits ceramic slurry and electrode paste directly onto the green sheet without physical contact, eliminating the need for lamination machines and precise handling mechanisms. This substitution of mechanical systems with a non-contact deposition process resolves the contradiction by improving productivity while reducing device complexity.
2Length of moving object
If chip size is reduced to 0.4 mm or less in length and 0.2 mm or less in width, then downsizing is achieved, but handling becomes difficult requiring precise handling mechanisms
Solution Approach 1:
The patent uses non-contact inkjet printing to form patterns directly on the green sheet, eliminating the need for mechanical lamination and handling of ultra-thin green sheets. This allows production of chips with length of 0.4 mm or less and width of 0.2 mm or less without requiring precise handling mechanisms, thus achieving downsizing while maintaining ease of operation.
3Ease of manufacture
If conventional lamination methods are used, then manufacturing process is established, but corner portions of chips are easily chipped increasing defect ratio
Solution Approach 1:
The patent replaces mechanical lamination with non-contact inkjet printing to deposit ceramic slurry and electrode paste directly onto the green sheet. This eliminates mechanical stress and handling operations that cause chipping at corner portions, thereby reducing the defect ratio while maintaining an established manufacturing process approach.
4Productivity
If non-contact inkjet printing is used to form ceramic patterns, then productivity increases and device complexity decreases, but manufacturing precision may be compromised
Solution Approach 1:
The patent optimizes parameters of the inkjet printing process including droplet size, deposition frequency, slurry viscosity, and firing conditions to achieve precise pattern formation. By carefully controlling these parameters, the method attains manufacturing precision comparable to conventional contact-type methods while maintaining the productivity and simplicity advantages of non-contact printing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of small-sized, high-performance ceramic electronic components with enhanced handling and reliability, reducing the risk of chipping and increasing productivity by eliminating the need for lamination machines and contact-type printing methods.
Implementation Method 1
forming an unfired ceramic pattern which forms the ceramic layer after firing and which has a circular plane shape by applying a ceramic slurry, which contains a ceramic material, to a predetermined location one time or a plurality of times repeatedly using a printing device which ensures that a discharge portion for discharging the ceramic slurry does not come into contact with an object to be printed
Data Source
AI summary
A ceramic electronic component which is easily downsized, has reduced difficulty in handling, and is hardly chipped in a chip; and a method for producing the ceramic electronic component. The method includes the steps of: forming an uncured ceramic pattern which forms a ceramic layer after firing and has a circular plane shape by applying a ceramic slurry, which contains a ceramic material, to a predetermined location one time or a plurality of times repeatedly using a non-contact-type printing device such as an ink-jet printer; and forming uncured internal electrode patterns which form internal electrodes after firing and each have a circular plane shape by applying an electrode paste, which contains an internal electrode material, to a predetermined location one time or a plurality of times repeatedly using an ink-jet printer.