Ceramic Electronic Component Intermediate Layer Adhesion
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Solution Overview
Problem
Existing laminated ceramic electronic components face issues with insufficient adhesion between dielectric layers, leading to peeling, due to differences in material characteristics and contraction behaviors during calcination, limiting the combination of materials for dielectric layers.
Innovation Solution
A ceramic electronic component design featuring a first dielectric layer with BaO, Nd2O3, and TiO2, a second dielectric layer with a different composition, and an intermediate layer containing a main component not present in both, which improves adhesion by suppressing pore generation and shift occurrence between layers, allowing for strong adhesive strength and stable lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different dielectric materials are laminated simultaneously, then material diversity and functional performance are improved, but adhesion between layers deteriorates causing peeling
Solution Approach 1:
The patent introduces a buffer layer composed of a green sheet containing glass ceramic particles as an intermediary between dielectric layers with different materials. This buffer layer mediates the adhesion between layers having different thermal expansion coefficients and contraction behaviors during calcination, preventing peeling while allowing diverse dielectric materials to be combined.
Solution Approach 2:
The patent changes the compositional parameters of the buffer layer by incorporating glass ceramic particles with specific composition ratios (SiO2: 70-90 wt%, Al2O3: 5-20 wt%, B2O3: 1-10 wt%). This parameter optimization enables the buffer layer to accommodate different dielectric materials while maintaining adhesion through controlled thermal and mechanical properties.
2Reliability
If dielectric layers with different material characteristics are combined, then functional performance is improved, but contraction behavior differences cause peeling during calcination
Solution Approach 1:
The buffer layer acts as a mediator that absorbs contraction differences between dielectric layers during calcination. The glass ceramic particles in the buffer layer provide a transition zone that accommodates different contraction behaviors, maintaining layer stability while allowing diverse functional materials to be combined.
Solution Approach 2:
The buffer layer is constructed as a composite material combining green sheet matrix with glass ceramic particles. This composite structure provides both mechanical support and thermal buffer characteristics, enabling it to handle contraction variations from different dielectric materials while maintaining structural integrity during calcination.
3Reliability
If an intermediate layer is added to improve adhesion, then layer stability is improved, but device structure becomes more complex
Solution Approach 1:
The buffer layer is implemented as a thin film green sheet that provides adhesion functionality without significant thickness. This thin-film approach maintains layer stability while minimizing the impact on overall device complexity and size.
Solution Approach 2:
The buffer layer uses a homogeneous green sheet composition containing glass ceramic particles distributed uniformly throughout the matrix. This homogeneity simplifies the manufacturing process and structure compared to using multiple different intermediate materials, reducing device complexity while maintaining adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The intermediate layer enhances the adhesive strength between dielectric layers, preventing peeling and enabling the use of diverse dielectric materials, thus improving the reliability and performance of ceramic electronic components.
Implementation Method 1
an intermediate layer provided between the first dielectric layer and the second dielectric layer and containing a main component that is not contained in the first dielectric layer and the second dielectric layer in common
Data Source
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AI summary
A ceramic electronic component (10) includes a first dielectric layer (11), a second dielectric layer (12), and an intermediate layer (13). The first dielectric layer (11) is a layer containing BaO, Nd2O3, and TiO2, the second dielectric layer (12) is a layer containing a different material from the material of the first dielectric layer, and the intermediate layer (13) is a layer formed between the first dielectric layer (11) and the second dielectric layer (12) and containing main components that are not contained in the first dielectric layer (11) and the second dielectric layer (12) in common as the main components.