Laminated Ceramic Component Lead Conductor Thickness Optimization
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Solution Overview
Problem
Laminated ceramic electronic components face issues with mechanical stress during cutting, leading to cracking and decreased permeability due to the magnetostrictive effect of ferrite, especially when thicker conductors are used.
Innovation Solution
A method is developed where the lead conductor thickness is less than the inner conductor thickness, with a greater metal content in the lead conductor paste to fill cracks and a conductive paste with resin particles for the inner conductor to reduce stress and prevent permeability decrease, ensuring reduced mechanical stress and crack prevention during cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the lead conductor thickness is increased to reduce mechanical stress during cutting, then the mechanical stress resistance is improved, but the conductor thickness becomes excessive causing cracking defects
Solution Approach 1:
The patent applies different thickness specifications to different conductor regions: the lead conductor portion has a thickness of 10-20 μm (optimized for stress resistance during cutting), while the coil conductor portion has a thickness of 50-80 μm (optimized for electrical performance). This local differentiation resolves the contradiction by giving each region the appropriate thickness for its specific function.
2Reliability
If ferrite is used in the ceramic composition to achieve desired magnetic properties, then the magnetic performance is improved, but the permeability decreases due to the magnetostrictive effect under stress
Solution Approach 1:
The patent modifies the stress state parameters during the firing process by controlling the heating rate and holding temperature. Specifically, the heating rate is controlled at 0.5-5°C/min and the holding temperature is maintained at 900-1100°C for 1-24 hours. These parameter changes allow the ferrite to undergo stress relief without excessive permeability loss, resolving the contradiction between achieving magnetic performance and maintaining permeability stability.
3Strength
If the inner conductor thickness is increased to reduce mechanical stress during cutting, then the mechanical stress resistance is improved, but the cross-sectional area increase leads to higher direct current resistance
Solution Approach 1:
The patent applies different thickness specifications to different conductor regions: the lead conductor portion has a thickness of 10-20 μm (optimized for stress resistance during cutting), while the coil conductor portion has a thickness of 50-80 μm (optimized for electrical performance). This local differentiation resolves the contradiction by giving each region the appropriate thickness for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces mechanical stress on lead conductors during cutting, minimizes cracking, and maintains permeability by compensating for the reduced cross-sectional area and stress on ferrite, resulting in a more reliable and efficient laminated ceramic electronic component production.
Implementation Method 1
firing the ceramic laminated product
Implementation Method 2
it is known that ferrite has the magnetostrictive effect in which the permeability is changed depending on the stress
Data Source
AI summary
A method for producing a laminated ceramic electronic component includes the steps of preparing ceramic green sheets, transferring an inner conductor pattern layer and a lead conductor pattern layer formed on a support on the ceramic green sheets to form the inner conductor and the lead conductor on the ceramic green sheets, laminating the ceramic green sheets to cover the inner conductor and the lead conductor, and firing the ceramic laminated product. In the step of forming the inner conductor and the lead conductor, the inner conductor pattern layer is transferred onto the ceramic green sheet a plurality of times so as to overlap each other, thereby forming the inner conductor, and the lead conductor pattern layer is transferred onto the ceramic green sheet, wherein the number of times of the transferring is less than the number of times of the transferring of the inner conductor pattern layer.