Ceramic Chamber Component Cleaning With Ultrasonic and Megasonic Conditioning
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Solution Overview
Problem
Existing methods for cleaning ceramic components used in semiconductor wafer plasma processing chambers are ineffective in removing submicron and nanometer-sized particles, leading to defects and reduced productivity due to extended seasoning times and resource consumption.
Innovation Solution
A method involving megasonic cleaning using a megasonic conditioning solution and transducer head to apply high-frequency acoustic energy, combined with chemical solutions, effectively removes submicron and nanometer-sized particles from ceramic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning methods are used for ceramic components, then the cleaning process is simple and quick, but submicron and nanometer-sized particles cannot be effectively removed
Solution Approach 1:
The patent employs ultrasonic vibration at frequencies between 20-100 kHz to generate cavitation bubbles in the cleaning solution. These bubbles collapse near the ceramic component surface, creating micro-jets and shock waves that mechanically dislodge submicron and nanometer particles from complex geometries including porous structures and blind holes, achieving thorough cleaning without increasing overall system complexity
Solution Approach 2:
The patent introduces a cleaning solution as an intermediary medium between the ultrasonic transducer and the ceramic component. The solution transmits ultrasonic energy throughout the component's complex geometry and provides chemical cleaning action, enabling effective particle removal from difficult-to-reach areas while keeping the ultrasonic transducer external to the component
2Reliability
If extended seasoning time is used to ensure component cleanliness, then particle contamination is reduced, but productivity and resource consumption are negatively impacted
Solution Approach 1:
The patent replaces the traditional mechanical/chemical cleaning approach with ultrasonic cavitation-based cleaning. This substitution enables effective removal of submicron and nanometer particles in a single treatment cycle, eliminating the need for extended seasoning time and multiple sequential cleaning steps, thereby significantly improving productivity while maintaining component cleanliness
Solution Approach 2:
The patent performs thorough particle removal through ultrasonic cleaning before the component is installed in the plasma processing chamber. This preliminary action ensures that all submicron and nanometer particles are removed in advance, preventing future contamination issues and eliminating the need for extended in-chamber seasoning time, thus improving overall productivity
3Manufacturing precision
If conventional cleaning methods are used, then the process is fast and resource-efficient, but cleaning effectiveness for submicron particles is insufficient
Solution Approach 1:
The patent uses high-frequency ultrasonic vibration (20-100 kHz) to generate intense cavitation effects that mechanically impact particle-laden surfaces. This vibration-based cleaning mechanism achieves superior removal of submicron and nanometer particles from complex ceramic geometries in a single treatment cycle, reducing total cleaning time compared to conventional multi-step methods
Solution Approach 2:
The patent changes the physical parameters of the cleaning process by using ultrasonic frequencies (20-100 kHz) and controlling solution temperature (20-80°C) to optimize cavitation bubble formation and collapse. These parameter changes enhance cleaning effectiveness for submicron particles while maintaining reasonable processing time, achieving both precision and efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves superior cleaning results, reducing seasoning time and resource use by eliminating submicron and nanometer-sized particles, enhancing chamber productivity and wafer processing efficiency.
Implementation Method 1
A megasonic transducer head comprises at least one megasonic transducer to provide megasonic energy to the megasonic conditioning solution, wherein the megasonic energy is delivered to the component via the megasonic conditioning solution
Implementation Method 2
The component is placed in an ultrasonic conditioning solution in an ultrasonic solution tank. Ultrasonic energy is applied through the ultrasonic conditioning solution to the component to clean the component
Data Source
AI summary
A method for conditioning a component of a wafer processing chamber is provided. The component is placed in an ultrasonic conditioning solution in an ultrasonic solution tank. Ultrasonic energy is applied through the ultrasonic conditioning solution to the component to clean the component. The component is submerged in a megasonic conditioning solution in a tank. Megasonic energy is applied through the megasonic conditioning solution to the component to clean the component.