Laminated Ceramic Component Mounting Structure for Acoustic Noise Reduction

Solution Overview

Problem

Laminated ceramic capacitors using high-dielectric ceramic materials can cause acoustic noise due to mechanical strain when a voltage is applied, leading to vibration that can propagate to circuit boards, and existing solutions that divide the electrode land to mitigate this issue face challenges in small-sized capacitors where dividing the electrode land is difficult and may result in mounting failures.

Innovation Solution

A laminated ceramic electronic component mounting structure where the ceramic component has terminal electrodes that extend over specific surfaces and are connected to electrode lands on a circuit board, with the electrode lands positioned between the widthwise edges of the inner electrodes, allowing for noise reduction without dividing the electrode land.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the electrode land is divided to reduce vibration propagation, then acoustic noise is reduced, but mounting reliability deteriorates due to displacement risk

Engineering Contradiction:

Improveacoustic noiseVSAvoidmounting reliability

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent applies segmentation by dividing the electrode land into multiple separate electrode lands (first electrode land and second electrode land) on the circuit board. Each electrode land connects to corresponding terminal electrodes, creating distinct connection points that reduce vibration transmission while maintaining secure mounting through distributed attachment points.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by positioning the electrode lands at specific locations on the circuit board that are optimized for both mounting security and vibration isolation. The electrode lands are arranged to connect with terminal electrodes at positions that minimize vibration propagation paths while ensuring stable mechanical attachment.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If the electrode land is divided to reduce vibration propagation, then acoustic noise is reduced, but device complexity increases

Engineering Contradiction:

Improveacoustic noiseVSAvoidelectrode land configuration

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the electrode land into multiple separate electrode lands (first electrode land and second electrode land) on the circuit board. Each electrode land connects to corresponding terminal electrodes, creating distinct connection points that reduce vibration transmission while maintaining secure mounting through distributed attachment points.

Inventive Principle:

Principle #1Segmentation

3Volume of moving object

If the capacitor size is reduced, then component size decreases, but the ability to divide electrode land is lost

Engineering Contradiction:

Improvecapacitor sizeVSAvoidelectrode land division feasibility

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent applies dimensionality change by transitioning from a single large electrode land to multiple smaller electrode lands distributed across the circuit board surface. This dimensional redistribution allows the electrode connection function to be maintained while enabling vibration isolation through spatial separation, even when the overall component size is reduced.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces noise by minimizing the vibration transfer from the ceramic component to the circuit board, maintaining secure mounting and preventing potential mounting failures, even in small-sized capacitors.

Implementation Method 1

The high-dielectric ceramic material has piezoelectricity and electrostriction. Accordingly, mechanical strain is caused when a voltage is applied to the laminated ceramic capacitor using the high-dielectric ceramic material.

Methodology Applied

Scientific EffectPiezoelectricity: Piezoelectric Effect

Implementation Method 2

The high-dielectric ceramic material has piezoelectricity and electrostriction. Accordingly, mechanical strain is caused when a voltage is applied to the laminated ceramic capacitor using the high-dielectric ceramic material.

Methodology Applied

Scientific EffectElectrostriction: Electrostriction

Data Source

PatentUS9953765B2Laminated ceramic electronic component mounting structure

Publication Date: 2018.04.24 MURATA MFG CO LTD

AI summary

A laminated ceramic electronic component mounting structure includes a laminated ceramic electronic component including a ceramic body, first and second inner electrodes in the ceramic body including opposed portions including at least portions of which are opposed to each other in a thickness direction of the ceramic body, a first terminal electrode electrically connected to the first inner electrode, and a second terminal electrode electrically connected to the second inner electrode; and a circuit board including first and second electrode lands electrically connected to the first and second terminal electrodes and on which the laminated ceramic electronic component is mounted, wherein widths of the first and second electrode lands are smaller than widths of the first and second inner electrodes at the opposed portions.