Ceramic Electronic Component Ni-Sn Alloy Interface Reflow Detachment
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Solution Overview
Problem
Multilayer ceramic capacitors experience detachment from metal terminals during the reflow process due to solder melting, leading to potential noise issues and mechanical instability when mounted on a substrate.
Innovation Solution
A ceramic electronic component design featuring Ni-plated films on outer electrodes and metal terminals, with an alloy layer containing Ni—Sn at the bonding interface, which has a high melting point to prevent detachment during reflow processes, and ensures strong connections between the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If soldering is used to connect metal terminals to outer electrodes, then the components can be fixed together, but the solders may be melted during reflow process causing detachment
Solution Approach 1:
The patent changes the material composition parameter of the plating layer to contain Ni-Sn alloy with controlled composition ratios. This parameter change increases the melting point of the bonding interface from typical solder melting points (around 180-260°C) to above the reflow process temperature, preventing熔化 during mounting while maintaining adequate bonding strength.
Solution Approach 2:
The patent creates a composite plating structure with multiple layers including Ni-Sn alloy layers combined with other metal layers. This composite material approach combines the high melting point characteristic of Ni-Sn alloys with the bonding properties of other materials, achieving both high-temperature resistance and reliable connection.
2Reliability
If metal terminals are directly soldered to outer electrodes, then connection is achieved, but noise vibration transmits to mounting substrate
Solution Approach 1:
The patent introduces a multi-layer plating structure as an intermediary between the metal terminal and outer electrode. This intermediary layer acts as a vibration isolation interface that decouples the mechanical vibration from the mounting substrate while maintaining electrical and mechanical connection, thus reducing acoustic noise transmission.
3Temperature
If lead-free high-temperature solder is used, then temperature resistance is improved, but detachment still occurs at reflow temperatures of 220-260°C
Solution Approach 1:
The patent fundamentally changes the temperature parameter threshold by using Ni-Sn alloy plating with melting point exceeding 260°C (reflow temperature). This parameter change ensures the bonding interface remains solid and maintains bonding strength throughout the reflow process, eliminating the detachment issue that occurs with conventional lead-free solders.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the strength of the connected portions between metal terminals and outer electrodes, preventing detachment during reflow processes and reducing noise transmission to the mounting substrate.
Implementation Method 1
an alloy layer containing Ni—Sn is provided in at least a portion of a bonding interface between adjacent two of the outer electrodes and the first and second metal terminals
Implementation Method 2
first and second metal terminals connected to the outer electrodes by solders containing Sn as a main constituent
Data Source
AI summary
A ceramic electronic component includes an electronic component body and first and second metal terminals. The electronic component body includes a bare ceramic body and first and second outer electrodes. The first and second outer electrodes of the electronic component body are connected respectively to the first and second metal terminals by solders containing Sn as a main constituent. An alloy layer containing Ni—Sn is provided in at least a portion of a bonding interface between adjacent two of the first and second metal terminals and the first and second outer electrodes.