Ceramic Electronic Component Non-Electrode Region Connectivity
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in maintaining connectivity and reliability due to the thinness of internal electrode layers, which can lead to breakage during sintering and reduced capacitance, especially as devices become smaller and more complex.
Innovation Solution
Incorporating a non-electrode region within the internal electrode layer with a controlled area ratio of ceramic-based substance powder to metal powder, and adjusting the firing temperature and heating rate to restrain sintering shrinkage and enhance connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the internal electrode layer is made thinner to reduce device size, then miniaturization is achieved, but connectivity and reliability deteriorate due to breakage during sintering
Solution Approach 1:
The patent changes the chemical composition parameters of the conductive paste by incorporating ceramic-based substance powder with specific grain size ratios exceeding 1:5 relative to metal powder. This compositional parameter change allows the internal electrode layer to maintain connectivity during sintering even at reduced thickness, resolving the contradiction between miniaturization and reliability
Solution Approach 2:
The patent creates a composite conductive paste material combining metal powder and ceramic-based substance powder in specific proportions. This composite material structure provides both the conductivity needed for thin layers and the structural stability required to prevent breakage during sintering, enabling simultaneous achievement of miniaturization and maintained connectivity
2Quantity of substance
If the internal electrode layer thickness is reduced to increase capacitance density, then high capacitance is achieved, but manufacturing precision deteriorates due to difficulty in maintaining uniform thickness
Solution Approach 1:
The patent modifies the rheological and firing parameters of the conductive paste by incorporating ceramic-based substance powder with controlled grain size distribution. This parameter change enables better flow characteristics during application and more uniform sintering behavior, allowing precise control of thin electrode layer thickness while maintaining high capacitance density
3Manufacturing precision
If the sintering temperature is increased to improve densification, then manufacturing precision is improved, but reliability worsens due to increased shrinkage and potential breakage of thin electrode layers
Solution Approach 1:
The ceramic-based substance powder in the composite conductive paste acts as a structural reinforcement that maintains electrode layer integrity during high-temperature sintering. The composite structure allows aggressive densification schedules to be used while the ceramic phase prevents excessive shrinkage and breakage of the thin metal electrode layers
Solution Approach 2:
The ceramic-based substance powder serves as an intermediary material that mediates between the metal powder particles during sintering. It provides a stable matrix that controls shrinkage behavior and prevents direct contact and potential bridging of metal particles, thereby maintaining electrode layer integrity while allowing thorough densification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach secures high connectivity and capacitance in thin internal electrode layers, preventing disconnection and improving the reliability and performance of multilayer ceramic capacitors.
Implementation Method 1
The non-electrode region may be formed by firing a conductive paste forming the internal electrode layer at a heating rate ranging from 30° C./60 s to 50° C./60 s
Data Source
AI summary
There are provided a ceramic electronic component and a method of manufacturing the same. The ceramic electronic component includes: a ceramic element; and an internal electrode layer formed within the ceramic element, having a thickness of 0.5 μm or less, and including a non-electrode region formed therein, wherein an area ratio of the non-electrode region to an electrode region of the internal electrode layer, in a cross section of the internal electrode layer is between 0.1% and 10%, and the non-electrode region includes a ceramic component.