Multilayer Ceramic Component Recessed Electrode Design
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Solution Overview
Problem
Multilayer ceramic electronic components experience cracks and delamination due to the compression of internal electrodes and dielectric layers during miniaturization and high-capacity manufacturing, leading to reduced reliability and productivity, as well as moisture and plating solution permeation.
Innovation Solution
A multilayer ceramic electronic component design featuring first and second internal electrodes with recessed regions partially filled with dielectric material, connected to external electrodes, which helps to reduce stress and enhance bonding strength between the electrodes and dielectric layers, thereby suppressing cracks and delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the multilayer ceramic electronic component is miniaturized and compressed into a small space to achieve high capacitance, then the capacitance and integration density are improved, but cracks and delamination occur more frequently, lowering reliability
Solution Approach 1:
The patent applies local quality by creating a recessed region with different structural characteristics at a specific location of the internal electrode. This recessed region has a different shape (concave instead of flat) and is filled with dielectric material, creating a localized area with enhanced properties that prevents cracks and delamination without affecting the overall miniaturization and high capacitance design of the component.
Solution Approach 2:
The recessed region filled with dielectric material acts as a preemptive stress-relief structure that cushioning against the compression forces applied during miniaturization. This structural feature is built in advance to prevent cracks and delamination before they can occur during the compression process or subsequent usage.
2Volume of moving object
If the internal electrodes and dielectric layers are compressed into a small space to achieve miniaturization, then the size is reduced, but the bonding strength between layers decreases, causing delamination
Solution Approach 1:
The patent enhances bonding strength locally at the internal electrode through the recessed region design. The recessed area filled with dielectric material creates a localized zone with improved adhesion properties, ensuring strong bonding between the internal electrode and dielectric layers at this critical location without requiring the entire structure to be larger.
Solution Approach 2:
The recessed region introduces a dimensional variation (concave shape) to the internal electrode structure. This three-dimensional structural modification creates additional surface area and mechanical interlocking capability in the vertical dimension, enhancing bonding strength without increasing the overall footprint of the component.
3Productivity
If cracks and delamination occur during compression, then productivity is lowered due to manufacturing defects, but continuing compression is necessary to achieve high capacitance
Solution Approach 1:
The recessed region design addresses the specific problem area where cracks and delamination typically occur during compression. By locally modifying the electrode structure at this critical location, the patent prevents manufacturing defects without requiring changes to the overall compression process or component design, thereby maintaining both productivity and capacitance.
Solution Approach 2:
The recessed region filled with dielectric material serves as a preventive measure built into the structure before compression. This preemptive design feature cushioning against the compressive forces that would otherwise cause cracks and delamination, allowing the manufacturing process to proceed smoothly with high yield while achieving the desired high capacitance.
Data Source
AI summary
A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The first internal electrode has a plurality of first ends connected to the first external electrode and a first recessed region positioned between the plurality of first ends, the first recessed region at least partially filled with a dielectric material. The second internal electrode has a plurality of second ends connected to the second external electrode and a second recessed region positioned between the plurality of second ends, the second recessed region at least partially filled with the dielectric material.