Ceramic Electronic Component Recessed Resin Coating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for coating ceramic electronic components with resin to prevent chemical erosion and defective mounting issues, such as the tombstone phenomenon, are costly and inefficient due to non-selective film formation and increased component size.
Innovation Solution
A ceramic electronic component with a recessed resin coating film containing cationic elements from the ceramic material, selectively formed on the surface and recessed from external electrodes, using a resin with a thermal decomposition temperature of 240°C or higher, such as epoxy or polyimide resin, to enhance chemical erosion resistance and prevent tombstone phenomenon.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin coating is applied over the entire surface of the electronic component, then chemical erosion resistance is improved, but manufacturing cost increases due to additional steps of forming and removing coating film
Solution Approach 1:
The coating film is applied selectively only on the ceramic element surface where chemical erosion resistance is needed, rather than on the entire component surface. This localized coating approach reduces the complexity of the manufacturing process and eliminates the need for additional steps of forming and removing coating film on end surfaces, thereby reducing manufacturing cost while maintaining chemical erosion resistance.
2Reliability
If resin coating is applied after external electrode formation, then coating can be selective, but manufacturing cost increases due to masking operations
Solution Approach 1:
The coating film is formed on the ceramic element surface before the external electrodes are formed. This preliminary coating action eliminates the need for subsequent masking operations to protect electrodes during coating, as the coating is already in place on the ceramic surface. The external electrodes are then formed on top of or adjacent to the coating film, simplifying the manufacturing process and reducing costs.
3Reliability
If resin coating film thickness is increased to prevent plating solution ingress, then chemical erosion resistance is improved, but component size increases causing tombstone phenomenon
Solution Approach 1:
The coating film is applied selectively only on the ceramic element surface where chemical erosion resistance is needed, with controlled thickness that prevents plating solution ingress without causing the ceramic element to protrude from the wrapping parts of external electrodes. This localized, controlled-thickness coating eliminates the tombstone phenomenon while maintaining chemical erosion resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for inexpensive, selective coating that reduces manufacturing costs and prevents defective mounting by recessing the coating film from external electrodes, ensuring effective chemical erosion resistance and high heat resistance.
Implementation Method 1
the cationic element eluted from the ceramic element is deposited and contained in the coating film
Implementation Method 2
coating the ceramic element surfaces can reduce the influence of chemical erosion on the ceramic elements
Implementation Method 3
the resin has a thermal decomposition temperature of 240°C or higher
Data Source
AI summary
A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes on a surface of the ceramic element. The coating film includes cationic elements from a constituent element of the ceramic element, which are ionized and deposited from the ceramic element, and a resin. The surface of the coating film is recessed relative to a surface of wrapping parts of the external electrodes on the surface of the ceramic element.