Multilayer Ceramic Component Recesses Prevent Toppling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic electronic components with increased stacked layers for high capacitance often topple over when mounted on printed circuit boards due to their thickness exceeding their width, leading to increased failure rates and potential short-circuits.
Innovation Solution
A multilayer ceramic electronic component design featuring a ceramic body with inwardly concave recess portions on its main surfaces, supporting internal electrodes with varying thicknesses and connectivity, and external electrodes to prevent toppling, along with a printed circuit board with electrode pads for secure mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of stacked layers is increased to achieve high capacitance, then the capacitance level is improved, but the thickness becomes greater than the width causing the component to topple over during mounting
Solution Approach 1:
The invention changes the dimensional relationship by increasing the width dimension through protrusions while maintaining the thickness required for high capacitance. This dimensional adjustment allows the component to meet both high capacitance requirements and mounting stability requirements by making the width greater than the thickness through structural modification rather than reducing the number of layers.
Solution Approach 2:
The invention introduces asymmetric protrusions on opposite surfaces of the component that extend beyond the end surfaces. These asymmetric structural additions increase the effective width at the mounting surfaces, creating a stable mounting configuration where the width exceeds the thickness, thereby preventing toppling during mounting while preserving the internal high-capacitance structure.
2Reliability
If the thickness of dielectric layers and internal electrodes is reduced to increase the number of stacked layers, then the capacitance is improved, but the component height increases causing toppling during mounting
Solution Approach 1:
Instead of reducing dielectric and electrode thicknesses which increases the number of layers and overall thickness, the invention adds protrusions that extend the width dimension. This allows maintaining thinner individual layers for high capacitance while compensating for the increased overall thickness by expanding the width at mounting surfaces, thus preventing toppling.
Solution Approach 2:
The component is segmented into a body portion containing the stacked dielectric layers and internal electrodes, and protrusion portions extending from opposite surfaces. This segmentation allows the body to be optimized for capacitance with reduced layer thicknesses while the protrusions provide the necessary width extension for mounting stability, separating the functional requirements into distinct structural elements.
Data Source
AI summary
A multilayer ceramic electronic component includes: a ceramic body including a recess portion formed in a length direction of at least one main surface thereof so as to be inwardly concave and satisfying T (thickness)/W (width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to the at least one main surface, wherein when the ceramic body is divided into an upper region At, corresponding to 70% to 90% of an overall thickness of the ceramic body, and a lower region Ab, corresponding to 10% to 30% of the overall thickness of the ceramic body, a ratio of an average particle size of Ab materials to an average particle size of At materials is less than 0.5.