Ceramic Electronic Component Reinforcement Layer Design
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Solution Overview
Problem
Ceramic electronic components with thin flat ceramic bodies face challenges in achieving high mechanical strength due to the tendency for decreased mechanical durability as thickness decreases, and existing reinforcement methods are insufficient in preventing cracks.
Innovation Solution
The ceramic electronic component design includes external electrodes with specific conductor layer configurations and reinforcement layers formed of metal or alloy, where portions not facing the reinforcement layers are thicker, and reinforcement layers are strategically placed within the ceramic body to enhance mechanical durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the ceramic body is reduced to make the component thinner, then the component size is reduced, but the mechanical strength decreases
Solution Approach 1:
The patent forms reinforcement conductor layers (buffer layers) within the ceramic body by printing conductor paste patterns on ceramic green sheets before lamination. These embedded metal layers create a composite structure that significantly enhances the mechanical strength of thin ceramic bodies, allowing the component to be both thin and mechanically robust.
Solution Approach 2:
The reinforcement conductor layers are strategically positioned at specific locations within the ceramic body where mechanical strength is most needed. The conductor layers are formed in outer layer portions and can be arranged to provide localized reinforcement without requiring the entire ceramic body to be thicker.
2Strength
If reinforcement conductor layers are formed in the ceramic body, then the mechanical strength is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent combines the formation of reinforcement conductor layers with the standard external electrode formation process. The same conductor paste printing and lamination steps used for creating external electrodes are also used to form the reinforcement layers, merging multiple functions into a unified manufacturing process and avoiding additional complex steps.
Solution Approach 2:
The conductor layers serve dual functions: they act as reinforcement buffer layers to enhance mechanical strength and also function as external electrodes for electrical connection. This multi-functionality reduces the need for separate reinforcement structures and simplifies the overall device design.
3Length of moving object
If the ceramic body is made thinner for compact devices, then the device compactness is improved, but the mechanical durability decreases
Solution Approach 1:
By embedding reinforcement conductor layers within the thin ceramic body, the patent creates a composite structure that maintains the thin profile while significantly improving mechanical durability. The metal layers act as a reinforcement skeleton that prevents crack propagation and enhances overall structural integrity.
Solution Approach 2:
The reinforcement layers are positioned in the outer layer portions of the ceramic body where they most effectively prevent crack initiation and propagation. This localized reinforcement strategy maximizes durability improvement while minimizing the impact on overall component thickness.
Data Source
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AI summary
A ceramic electronic component (1) includes a first reinforcement layer. The first reinforcement layer (17a) is formed in a first outer layer portion so as to extend in the length direction and in the width direction. Portions of the first reinforcement layer (17a) face a first portion (13a) of a first external electrode (13) and a first portion of a second external electrode in the thickness direction. The first reinforcement layer (17a) is not exposed from a first end surface or a second end surface of the ceramic electronic component. In a portion of a first main surface (10a) of the ceramic electronic component where the first portion (13a) of the first (13) or second external electrode is provided, a portion (10a1) that does not face the first reinforcement layer is closer to the center in the thickness direction than a portion that faces the first reinforcement layer is.