Ceramic Electronic Component Conductive Resin Interface Separation
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Solution Overview
Problem
Ceramic electronic components, such as multilayer ceramic capacitors, are prone to cracking due to internal and external forces, and replacing intermediate metal layers with conductive resin layers can lead to interface separation issues.
Innovation Solution
A ceramic electronic component with an intermediate conductive resin layer made of epoxy resin containing conductive filler, where the layer meets specific spectral intensity conditions (B/A≦0.47 and C/A≧0.39) to minimize interface separation, as determined by ATR method analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If intermediate metal layers are replaced with intermediate conductive resin layers made of synthetic resin containing conductive filler, then internal force and external force are reduced, but interface separation occurs between the conductive resin layer and metal layers
Solution Approach 1:
The patent applies parameter changes by optimizing the glass transition temperature (Tg) of the epoxy resin to be 80°C or higher, and controlling the ratio of spectral intensities (B/A ≤ 0.47 and C/A ≥ 0.39) in the infrared spectrum. These parameter adjustments enhance the thermal stability and bonding characteristics of the conductive resin layer, preventing interface separation while maintaining reduced internal and external forces.
Solution Approach 2:
The patent uses composite materials by combining epoxy resin with specific glass powder fillers to create the intermediate conductive resin layer. This composite structure provides both the stress-absorbing properties of the resin matrix and the thermal stability and bonding enhancement from the glass powder, effectively preventing interface separation while maintaining force resistance.
2Ease of manufacture
If conventional synthetic resin containing conductive filler is used for intermediate conductive resin layer, then manufacturing is simplified, but interface separation occurs under thermal stress
Solution Approach 1:
The patent maintains ease of manufacture by continuing to use a conductive resin layer made of epoxy resin containing glass powder and conductive filler. The manufacturing process remains simple coating and drying operations. The reliability improvement comes from changing the material parameters: using epoxy resin with Tg ≥ 80°C and controlling the spectral intensity ratios (B/A ≤ 0.47 and C/A ≥ 0.39), which enhance thermal stress resistance without complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces interface separation between the conductive resin layer and metal layers, enhancing the reliability and heat resistance of ceramic electronic components.
Implementation Method 1
a two-axis graph representing the relationship line of the wave number and spectral intensity of the intermediate conductive resin layer as obtained by the ATR method
Data Source
AI summary
A ceramic electronic component includes external electrodes having a multi-layer structure including an intermediate conductive resin layer, wherein the intermediate conductive resin layer in the external electrode is made of epoxy resin containing conductive filler, and the intermediate conductive resin layer meets both the condition B/A≦0.47 and condition C/A≧0.39 (A, B and C represent the maximum spectral intensities obtained based on the relationship line of the wave number and spectral intensity of the intermediate conductive resin layer as obtained by the ATR method). The ceramic electronic component minimizes separation that could occur at the interface between such intermediate conductive resin layer and a metal layer.