Multilayer Ceramic Component Conductive Resin Layer Reliability
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Solution Overview
Problem
Multilayer ceramic electronic components face reliability issues due to infiltration of plating solutions and external impacts, which can lead to defects, especially in miniaturized and multi-functionalized components used in high-reliability applications like vehicles and medical devices.
Innovation Solution
A multilayer ceramic electronic component design featuring a ceramic body with internal electrodes and dielectric layers, an external electrode with a conductive resin layer containing metal particles and a base resin, and a plating layer, where the distribution and thickness of these components are optimized to ensure high reliability and low equivalent series resistance, as defined by specific dimensional relationships.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a large number of dielectric layers are stacked by decreasing thickness to achieve miniaturization and high capacitance, then the component size is reduced and capacitance is increased, but reliability deteriorates due to infiltration of plating solution and crack generation by external impacts
Solution Approach 1:
A conductive resin layer is applied onto the electrode layer of the external electrode before plating to absorb external impacts and prevent crack generation. This protective layer is positioned in advance to cushion against mechanical shocks that could propagate into the miniaturized ceramic body and cause reliability failures.
Solution Approach 2:
The conductive resin layer serves as an intermediary between the external electrode and the ceramic body, preventing direct infiltration of plating solution into the electrode layer. This intermediate layer blocks the harmful plating solution from reaching and damaging the internal structure during the plating process.
2Length of moving object
If the external electrodes are thinned to achieve miniaturization, then the component size is reduced, but reliability deteriorates due to increased susceptibility to external impacts and plating solution infiltration
Solution Approach 1:
The conductive resin layer is applied beforehand onto the thinned external electrode to provide mechanical cushioning against external impacts. This protective layer compensates for the reduced thickness of the external electrode, preventing cracks from forming or propagating into the ceramic body despite the electrode being thinner.
Solution Approach 2:
The conductive resin layer acts as an intermediary protective barrier on the thinned external electrode, preventing plating solution from infiltrating through the reduced-thickness electrode structure. This intermediary layer is crucial for protecting the vulnerable thinned electrode from chemical infiltration during plating.
3Reliability
If a conductive resin layer containing metal particles and base resin is applied onto the external electrode to prevent plating solution infiltration and absorb external impacts, then reliability is improved, but equivalent series resistance increases
Solution Approach 1:
The concentration, size distribution, and morphology of metal particles in the conductive resin layer are optimized to achieve the right balance between conductivity and protection. By adjusting these parameters, the resin layer provides sufficient impact absorption and plating solution barrier properties while minimizing the increase in equivalent series resistance through proper metal particle selection and arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized design enhances the reliability of multilayer ceramic electronic components by preventing plating solution infiltration and external impacts, while maintaining low equivalent series resistance, thus addressing the challenges of miniaturization and high-reliability demands.
Implementation Method 1
a resin composition containing a conductive material is applied onto an electrode layer of the external electrode to absorb the external impacts
Implementation Method 2
prevent the infiltration of the plating solution
Data Source
AI summary
A multilayer ceramic electronic component may include: a ceramic body in which a plurality of internal electrodes and a plurality of dielectric layers are stacked in a thickness direction; and an external electrode including an electrode layer disposed on an outer surface of the ceramic body to be connected to the internal electrodes, a conductive resin layer disposed on the electrode layer and containing metal particles and a base resin, and a plating layer disposed on the conductive resin layer.