Multi-layer Ceramic Component Rounded Ridge Chipping Prevention
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Solution Overview
Problem
Low-profile multi-layer ceramic electronic components face challenges in preventing chipping defects due to their thin height and short distance between the ceramic body surface and internal electrodes, making reliable chamfering difficult.
Innovation Solution
A multi-layer ceramic electronic component design featuring a ceramic body with a curved, convex ridge connecting the main and side surfaces, where the ridge's dimensions satisfy specific ratios (Rb/Ra > 3.0) to prevent chipping, and a configuration that allows for a thinner and flatter shape, ensuring a sufficient distance to internal electrodes for enhanced environmental resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the ceramic body is made thin to reduce component height, then the component height is reduced, but the distance between the surface and internal electrode becomes short making chamfering difficult
Solution Approach 1:
The patent applies curvature by forming a rounded ridge with radius Rb at the corner of the ceramic body instead of a sharp edge. This rounded shape prevents stress concentration and reduces chipping risk during handling and mounting, enabling the use of thin ceramic bodies while maintaining reliability. The specific requirement that Rb/Ra ≥ 3.0 ensures sufficient rounding to prevent chipping even in low-profile components.
2Reliability
If barrel polishing is performed to chamfer the ceramic body, then chipping is suppressed, but it becomes difficult to perform reliable chamfering in low-profile components
Solution Approach 1:
The patent applies preliminary action by forming the rounded ridge shape before final component assembly and mounting. The ridge rounding is created during the ceramic forming process itself, preparing the component in advance to resist chipping during subsequent handling, soldering, and mounting operations. This eliminates the need for post-forming chamfering processes that are difficult to perform on thin components.
Solution Approach 2:
The patent applies parameter changes by modifying the geometric parameters of the ceramic body corner, specifically introducing radius Rb and establishing the ratio Rb/Ra ≥ 3.0. This parameter change transforms the corner from a sharp edge prone to chipping into a rounded shape that distributes stress, thereby improving reliability without requiring complex manufacturing processes.
3Reliability
If the ridge is sufficiently rounded to prevent chipping, then chipping resistance is improved, but the distance to internal electrode may be insufficient
Solution Approach 1:
The patent applies local quality by concentrating the rounding only at the corner ridge where chipping occurs, rather than rounding the entire ceramic body surface. The rounded ridge with radius Rb is localized to the corner region, while the rest of the ceramic body maintains its original dimensions and internal electrode positioning. This ensures chipping resistance at the critical corner location without affecting the overall component geometry or electrode distance.
Data Source
AI summary
A multi-layer ceramic electronic component includes a ceramic body enclosing internal electrodes laminated in a first direction, wherein the ceramic body has a main surface having a flat face normal to the first direction, a first side surface having a flat face normal to a second direction orthogonal to the first direction, and a rounded ridge connecting the main surface and the first side surface to each other and curved in a convex shape; a maximum dimension of the ceramic body in the first direction is 120 μm or less; and the rounded ridge satisfies a condition of Rb/Ra>3.0, where Ra represents a dimension of the rounded ridge in the first direction and Rb represents a dimension of the rounded ridge in the second direction on a cross-sectional surface of the ceramic body taken along a virtual cut plane parallel to the first direction and the second direction.