Multilayer Ceramic Component Solder Fixing Strength

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Solution Overview

Problem

Multilayer ceramic electronic components face difficulties in ensuring fixing strength with solders when mounted on substrates due to the placement of external electrodes on mounting surfaces.

Innovation Solution

A multilayer ceramic electronic component design featuring a laminated body with a first external electrode and a pair of second external electrodes, along with insulating coating portions, where the maximum thickness of the first external electrode is greater than the second external electrodes, and the insulating coating portions overlap with these electrodes, providing enhanced solder fixing strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If external electrodes are disposed on mounting surfaces of laminated bodies, then the component structure is simplified and manufacturing is easier, but the fixing strength with solders during mounting is insufficient

Engineering Contradiction:
Improveease of manufactureVSAvoidfixing strength with solder
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The patent transitions from a two-dimensional electrode arrangement (on the mounting surface only) to a three-dimensional arrangement by extending external electrodes from both the mounting surface and the end surface of the laminated body. This dimensional change increases the solder contact area and improves fixing strength while maintaining manufacturing simplicity through conventional electrode formation processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The external electrodes are segmented into multiple portions: a first external electrode on the mounting surface and a second external electrode on the end surface. This segmentation allows each electrode portion to contribute to solder bonding independently, with the first electrode providing primary electrical connection and the second electrode providing additional mechanical anchoring and solder attachment area.

Inventive Principle:
Principle #1Segmentation

2Strength

If external electrodes are extended to increase solder contact area, then fixing strength with solder is improved, but the device complexity increases

Engineering Contradiction:
Improvefixing strength with solderVSAvoiddevice complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The extended external electrodes serve multiple functions simultaneously: they provide electrical connection to internal electrodes, increase solder contact area for improved fixing strength, and extend along the end surface to enhance mechanical stability. This multi-functionality achieves improved fixing strength without proportionally increasing device complexity, as the same structural feature accomplishes multiple objectives.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10361033B2Multilayer ceramic electronic component
Publication Date: 2019.07.23 MURATA MFG CO LTD
  • US10361033B2 patent drawing
  • US10361033B2 patent drawing
  • US10361033B2 patent drawing

AI summary

A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. A maximum thickness of the first external electrode on the second principal surface is larger than a maximum thickness of the pair of second external electrodes on the second principal surface. The maximum thickness of the pair of second external electrodes on the second principal surface is larger than a maximum thickness of the pair of insulating coating portions on the second principal surface.