Multilayer Ceramic Component Stress Relief via Organic Layer Roughness
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Solution Overview
Problem
Multilayer ceramic electronic components face reliability issues due to stress propagation from substrate warping, leading to cracks and deformations, which existing solutions inadequately address.
Innovation Solution
The use of a multilayer ceramic electronic component design featuring external electrodes with a conductive metal and glass base electrode layer, an organic silicon compound layer, and a plating layer, where the organic layer's surface roughness and adhesion strengths are optimized to enhance anchoring effects and prevent delamination, thereby reducing stress propagation and improving fixing strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external electrodes are joined to the principal surfaces of the ceramic body with base end-side joint parts, then the electrical connection is established, but the stress from substrate warping propagates through the joint parts to the ceramic body causing cracks
Solution Approach 1:
The patent introduces a wraparound part of the external electrode that extends around the end surface of the ceramic body, creating an intermediary structure between the joint part and the ceramic body. This wraparound configuration distributes the stress away from the ceramic body, preventing crack propagation while maintaining electrical connection functionality.
Solution Approach 2:
The external electrode transitions from a two-dimensional planar structure on the principal surface to a three-dimensional wraparound structure that extends around the end surface. This dimensional change allows the electrode to bypass the stress concentration zone at the joint part, effectively isolating the ceramic body from warping-induced stress.
2Strength
If the organic layer has smooth surface (low roughness), then the adhesion between layers is reduced, but if the surface is rough, then delamination occurs under stress
Solution Approach 1:
The patent applies different surface roughness characteristics to different regions of the organic layer. The portion of the organic layer on the end surface has a specific roughness range (0.5-2.0 μm) optimized for stress distribution, while other regions may have different roughness characteristics. This local differentiation allows simultaneous optimization of adhesion and delamination resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces stress propagation and prevents cracks in the ceramic and internal electrode portions, enhancing the reliability and performance of multilayer ceramic components by dispersing stress and maintaining adhesion between layers.
Implementation Method 1
a first organic layer including an organic silicon compound, disposed to cover the first base electrode layer
Implementation Method 2
a first base electrode layer including a conductive metal and a glass component
Data Source
AI summary
A multilayer ceramic electronic component includes a first plating layer in contact with a first organic layer and a second plating layer in contact with a second organic layer. When the first organic layer disposed on a first base electrode layer located on a first principal surface or a second principal surface, or the second organic layer disposed on a second base electrode layer located thereon, is referred to as an organic layer principal surface portion, and when the first organic layer disposed on the first base electrode layer located on a first end surface or a second end surface, or the second organic layer disposed on the second base electrode layer located thereon, is referred to as an organic layer end surface portion, the surface roughness of the organic layer end surface portion is larger than the surface roughness of the organic layer principal surface portion.