Ceramic Electronic Component Surface Recess Formation

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Solution Overview

Problem

Existing methods for roughening the surface of ceramic electronic components to improve contact with sealing resin often adversely affect the component's characteristics, such as chemical treatments leaving residues, blast processing deforming internal layers, and transfer processing requiring high pressure that can damage the component.

Innovation Solution

A method involving a laminated block with ceramic material and organic substance, where recesses are formed on the surface by relative movement with a protrusion surface, followed by firing to create a ceramic electronic component with improved surface roughness for enhanced resin contact without compromising the component's characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If chemical treatment with roughening liquid is used to roughen the main body surface, then close contact with sealing resin is improved, but the roughening liquid remains inside the main body and adversely affects component characteristics

Engineering Contradiction:

Improveclose contact with sealing resinVSAvoidroughening liquid residue

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces chemical treatment with a mechanical method: pressing an uneven surface against the main body surface during or after forming. This mechanical pressing creates recesses on the main body surface without introducing chemical substances that could remain as harmful residues inside the component.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If blast processing is used to roughen the main body surface, then close contact with sealing resin is improved, but corners and edge lines are excessively ground and mounting stability decreases

Engineering Contradiction:

Improveclose contact with sealing resinVSAvoidcorner and edge line integrity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by creating uneven surfaces and recesses specifically on the main body surface where contact with sealing resin is needed, while preserving the integrity of corners and edge lines. The pressing method allows selective roughening of the surface area without affecting the structural corners and edges.

Inventive Principle:

Principle #3Local quality

3Reliability

If transfer processing with large roughness or large pressure is used to obtain sufficient roughness, then close contact with sealing resin is improved, but deformation of inner conductor layer occurs and electric characteristic is adversely affected

Engineering Contradiction:

Improveclose contact with sealing resinVSAvoidinner conductor layer integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies partial action by using moderate pressing pressure that is sufficient to create the needed surface unevenness and recesses for resin contact, but not excessive enough to deform the inner conductor layer. The pressing force is controlled to achieve the minimum necessary roughness without causing harmful deformation.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method achieves improved close contact with sealing resin while maintaining the ceramic electronic component's characteristics, reducing ion migration and ensuring stable mounting and electric performance.

Implementation Method 1

providing a plurality of recesses in a first principal surface of a laminated block including a ceramic material and an organic substance by relatively moving the laminated block and a protrusion surface including a protrusion, in a direction along the first principal surface of the laminated block with the protrusion surface being in contact with the first principal surface of the laminated block

Methodology Applied

Scientific EffectMechanical deformation: Deformation

Implementation Method 2

obtaining the main body by firing the chip

Methodology Applied

Scientific EffectSintering: Sintering

Implementation Method 3

obtaining the main body by firing the chip

Methodology Applied

Scientific EffectThermal processing: Heating

Data Source

PatentUS10580580B2Method of manufacturing ceramic electronic component, and ceramic electronic component

Publication Date: 2020.03.03 MURATA MFG CO LTD

AI summary

A method of manufacturing a ceramic electronic component including a main body including a first principal surface and a second principal surface opposite to each other, and a first external electrode and a second external electrode provided on a portion of a surface of the main body, includes providing a plurality of recesses in a first principal surface of a laminated block including a ceramic material and an organic substance by relatively moving the laminated block and a protrusion surface including a protrusion, in a direction along the first principal surface of the laminated block with the protrusion surface being in contact with a first principal surface of the laminated block, obtaining a chip by cutting the laminated block including the recesses, and obtaining the main body by firing the chip.