Multilayer Ceramic Component Thinning via Clearance Space and Reinforcement
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Solution Overview
Problem
Conventional multilayer ceramic capacitors are difficult to thin due to their structural limitations, making them prone to breaking under load and unsuitable for miniaturization in electronic equipment, where higher functionality and smaller form factors are required.
Innovation Solution
A multilayer ceramic electronic component with internal electrode layers and insulation layers alternately laminated, featuring via-hole electrodes embedded in via holes to create a clearance space, which absorbs external loads and enhances structural integrity, allowing for a thinner profile without increasing the risk of cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the element body is thinned to achieve low profile, then the total thickness is reduced to 100 μm or less, but the mechanical strength decreases and the component becomes prone to breaking under load
Solution Approach 1:
The patent applies beforehand cushioning by forming a reinforcement layer on the lower surface of the element body before mounting. This reinforcement layer acts as a cushion that absorbs external loads applied during mounting operations (such as nozzle adsorption), preventing the thin element body from breaking. The reinforcement layer is formed by applying a paste containing ceramic powder and binder, then heating to form a strengthened surface that compensates for the reduced thickness.
Solution Approach 2:
The patent uses composite materials by creating a reinforcement layer composed of ceramic powder and binder material that, when heated, forms a composite structure on the element body surface. This composite reinforcement layer combines the properties of the base ceramic material with additional strengthening components, providing enhanced mechanical strength to the thinned element body without increasing its overall thickness.
2Length of stationary object
If the element body is thinned to achieve low profile, then the total thickness is reduced to 100 μm or less, but the component becomes more susceptible to cracking under thermal shock
Solution Approach 1:
The reinforcement layer serves as a protective cushion that mitigates thermal shock effects on the thinned element body. By providing a buffer zone on the lower surface, the reinforcement layer reduces stress concentration during thermal expansion and contraction, preventing cracks from forming in the thin ceramic structure.
Solution Approach 2:
The composite reinforcement layer formed by ceramic powder and binder provides improved thermal shock resistance. The composite structure allows for controlled thermal expansion and stress distribution, protecting the thin element body from cracking under thermal shock conditions while maintaining the reduced thickness profile.
3Reliability
If conventional terminal electrode structures are used on both ends, then the electrode coverage is sufficient, but the element body cannot be thinned and the profile remains high
Solution Approach 1:
The patent applies the taking out principle by removing the terminal electrode from the lower surface of the element body, retaining it only on the upper surface. This extraction of the lower terminal electrode allows the element body to be thinned without compromising the essential electrical connection functionality, as the single-sided terminal electrode structure is sufficient for the application while enabling a lower profile.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The component achieves a low profile with a total thickness of 100 μm or less, improving mechanical strength and thermal shock characteristics, enabling easier integration into smaller electronic devices without significant cracking or breakage.
Implementation Method 1
a load from outside generates a metal deformation against the clearance space and is less transmitted to the ceramic element body
Implementation Method 2
improving bending strength by forming a reinforcement layer having a compressive stress on a lower surface of the element body
Data Source
AI summary
A multilayer ceramic electronic component includes an element body, a via-hole electrode, and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The via-hole electrode penetrates from an upper surface of the element body thereinto and is connected with at least one of the internal electrode layers. The terminal electrode is formed on the upper surface of the element body and connected with the via-hole electrode. The via-hole electrode is embedded in a via hole formed on the element body so that a predetermined clearance space is formed in the via hole.