Ceramic-Supported Electrical Conductor Cooling in Metal Housings
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Solution Overview
Problem
Existing electrical devices face constraints in sizing electrical conductors due to heating issues, which limit flexibility and efficiency, as conductors must be sized based on current density to prevent overheating, restricting reduction in mass and size of the housing.
Innovation Solution
The device incorporates a housing with electrical conductors supported by ceramic supports that enhance thermal conductivity and electrical insulation, allowing for reduced conductor section area while maintaining effective heat dissipation, enabling increased current capacity and reduced material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the cross-section of the conductor is increased to reduce heating, then the heating is limited, but the mass of the conductors increases and the housing must be sized larger
Solution Approach 1:
The patent introduces a support structure as an intermediary element between the conductor and the housing. This support serves dual functions: providing mechanical support for the conductor and acting as a heat dissipation pathway. The support is made of thermally conductive material that contacts both the conductor and the housing, creating a thermal bridge that transfers heat away from the conductor without requiring the conductor itself to be larger.
Solution Approach 2:
The patent replaces the traditional approach of using larger conductor cross-sections for heat dissipation with a mechanical-thermal system. Instead of relying solely on the conductor's own thermal mass and surface area, the system uses a separate support structure with specific thermal conductivity properties to manage heat transfer. This substitution allows the conductor to maintain its optimal electrical cross-section while the support handles the thermal management function.
2Weight of stationary object
If the cross-section of the conductor is reduced to decrease mass, then material usage decreases, but excessive heating occurs
Solution Approach 1:
The support structure acts as a thermal intermediary that compensates for the reduced thermal mass of the thinner conductor. By providing an additional heat transfer pathway through the support to the housing, the system can use smaller conductors without risking overheating, as the support continuously conducts heat away from the conductor surface.
Solution Approach 2:
The patent changes the thermal parameters of the system by introducing a support with specific thermal conductivity characteristics. This parameter change allows the conductor cross-section to be reduced while maintaining acceptable temperature levels, as the overall thermal management of the system is improved through the support's heat conduction properties.
3Power
If the housing is sized larger to support larger conductors, then the conductors can carry higher current, but the device size increases
Solution Approach 1:
The support structure serves as a mediator that decouples the relationship between conductor size and housing size. By providing an external thermal management pathway, the support allows the use of smaller conductors for the same power capacity, which in turn allows for a more compact housing design while maintaining the required current carrying capability.
Solution Approach 2:
The patent moves the heat dissipation function from the conductor's own volume (one-dimensional scaling) to a separate support structure that extends into another spatial dimension. This dimensional separation allows the conductor to be optimized for electrical performance while the support handles thermal management, enabling more compact overall device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves cooling efficiency, reduces conductor material and housing size, and allows for higher current intensity without overheating, offering greater freedom in device sizing and cost reduction.
Implementation Method 1
Each support (25) is made of a material having a thermal conductivity greater than or equal to 10 Watts per meter and per Kelvin (Wm-1K-1)
Implementation Method 2
the support (25) is made of a material having a thermal conductivity greater than or equal to 10 Watts per meter and per Kelvin (Wm-1K-1) and an electrical conductivity greater than 10-10 Siemen per meter (S/m)
Data Source
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AI summary
A device comprising a housing, at least one electrical conductor (20), and at least one support (25), the electrical conductor (20) being configured to carry an electric current, the housing defining a chamber for the electrical conductor (20), the support (25) being configured to fix the electrical conductor (20) to the housing, the housing being made, in particular, of a metallic material. The support (25) is made of a ceramic, the support (25) being in contact with both the electrical conductor (20) and the housing.