Ceramic Compact Conductor Embedding for RF Performance
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Solution Overview
Problem
Conventional methods for producing ceramic compacts with buried conductors face issues such as peeling, deformation, and limited conductor thickness, which affect electrical properties and radio-frequency performance.
Innovation Solution
A ceramic compact is produced by coating a patterned conductor with a slurry containing a thermosetting resin precursor, ceramic powder, and a medium, which is then hardened, using a thermosetting resin precursor with an isocyanate- or isothiocyanate-containing gelling agent and a hydroxyl-containing polymer, allowing for increased conductor thickness and improved radio-frequency properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a conductor pattern is printed on a green sheet and the green sheets are stacked, then the conductor pattern forms a convex shape, but the portions surrounding the conductor pattern are not pressed, causing peeling and crushing of the conductor pattern edge
Solution Approach 1:
The conductor pattern is formed on a base before stacking the green sheets, allowing the conductor to be embedded within the ceramic structure rather than forming a convex shape on the surface. This preliminary positioning prevents peeling and crushing during the stacking process.
Solution Approach 2:
A base is introduced as an intermediary substrate to support the conductor pattern during the stacking process. The base provides a stable platform that prevents the conductor from being crushed or peeling off, while still allowing the green sheets to be stacked around it.
2Ease of manufacture
If the conductor pattern is printed on the green sheet, then the process is simple, but the thickness of the conductor pattern cannot be increased, limiting resistance reduction and radio-frequency property improvement
Solution Approach 1:
The conductor pattern is formed on a base and then green sheets are stacked around it, transitioning from a surface-level printing approach to a three-dimensional embedding approach. This allows the conductor thickness to be increased by adding more green sheet layers around the conductor, while still maintaining ease of manufacture through the printing process on the base.
3Ease of manufacture
If a slurry containing thermoplastic resin is used and the conductor paste contains thermoplastic resin, then the slurry can be applied, but the slurry shrinks greatly in the drying process, causing cracks near the conductor and uneven green sheet surface
Solution Approach 1:
The slurry composition is modified to use a thermosetting resin instead of a thermoplastic resin. This parameter change in the resin type prevents excessive shrinkage during drying, as thermosetting resins undergo crosslinking that maintains structural integrity and volume stability, thereby preventing cracks and surface unevenness.
4Manufacturing precision
If a large number of processes are used to produce multilayered conductor pattern stack, then each layer can be properly formed, but the production time and complexity increase significantly
Solution Approach 1:
Multiple green sheets with conductor patterns are stacked and integrated in a single process sequence, combining what would otherwise be separate formation processes into one unified stacking operation. This merging of steps maintains proper layer formation while significantly reducing production time and process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method prevents peeling and deformation of the conductor pattern, increases conductor thickness, lowers resistance, and enhances radio-frequency properties, resulting in a more reliable and efficient ceramic compact.
Implementation Method 1
a slurry containing a thermosetting resin precursor, ceramic powder, and a medium, which is then hardened
Implementation Method 2
using a thermosetting resin precursor with an isocyanate- or isothiocyanate-containing gelling agent and a hydroxyl-containing polymer
Implementation Method 3
an isocyanate- or isothiocyanate-containing gelling agent and a hydroxyl-containing polymer
Data Source
AI summary
A ceramic compact having a patterned conductor is obtained by coating the patterned conductor with a slurry and then by hardening the slurry. The slurry is prepared by mixing a thermosetting resin precursor, a ceramic powder, and a medium. In the ceramic compact, an isocyanate- or isothiocyanate-containing gelling agent and a hydroxyl-containing polymer are reacted and hardened to produce a thermosetting resin. The hydroxyl-containing polymer is preferably a butyral resin, an ethylcellulose-based resin, a polyethyleneglycol-based resin, or a polyether-based resin.