Embedded Ceramic Heat Conductor for Void-Free IGBT Heat Dissipation
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Solution Overview
Problem
Current vacuum welding technologies for IGBT chip packaging are complex, result in voids and uneven solder layers, leading to reduced heat conduction, thermoelectric breakdown, and shortened service life.
Innovation Solution
A heat dissipation element with an aluminum-clad ceramic heat conductor embedded into an aluminum silicon carbon heat dissipation body through aluminizing, featuring a ceramic insulating plate with integral aluminum layers, reducing voids and improving bonding strength and heat conduction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum welding technology is used to package IGBT chip, then the IGBT chip can be connected to heat dissipation body, but voids and uneven solder layers are formed leading to poor heat conduction and reduced reliability
Solution Approach 1:
The patent changes the welding parameters by controlling welding pressure (0.5-2.0 MPa), welding temperature (400-600°C), and welding time (5-30 seconds) to optimize the vacuum welding process. These parameter adjustments ensure uniform solder layer formation and eliminate voids, resolving the contradiction between reliability and manufacturing precision
Solution Approach 2:
The patent implements feedback control by monitoring welding process parameters and adjusting them in real-time. The welding pressure, temperature, and time are controlled based on feedback from the welding process to maintain optimal conditions, ensuring consistent welding quality and eliminating defects that would reduce reliability
2Ease of manufacture
If vacuum welding process is used with multiple steps, then IGBT chip packaging can be completed, but the production period becomes long and process complexity increases
Solution Approach 1:
The patent merges multiple packaging steps into a single integrated vacuum welding process. The aluminum-clad ceramic heat conductor is welded directly to the silicon carbide heat dissipation body in one continuous operation, eliminating intermediate steps and reducing production time while maintaining manufacturing completeness
Solution Approach 2:
The patent applies preliminary action by pre-forming the aluminum-clad ceramic heat conductor with optimized dimensions and properties before the welding process. This preparation ensures that the welding step can be completed quickly and efficiently, reducing overall production time while ensuring proper packaging
3Strength
If aluminum layer thickness is increased to improve bonding strength, then connection strength increases, but heat conduction efficiency decreases due to thicker aluminum layer
Solution Approach 1:
The patent optimizes the aluminum layer thickness parameter to a specific range (0.02-0.15 mm) that balances bonding strength and heat conduction efficiency. This precise parameter control ensures sufficient mechanical strength while minimizing thermal resistance, resolving the contradiction between strength and energy loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides higher connection strength, extended service life, improved heat conduction efficiency, and enhanced coldness and heat impact tolerance, while simplifying the manufacturing process and reducing production time.
Implementation Method 1
the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner
Implementation Method 2
the heat dissipation element has a good heat conduction effect
Data Source
Figure 1~3
AI summary
The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.