Ceramic Fluid Conduits for High-Bias Cryogenic Chamber Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrate support assemblies in semiconductor processing chambers face issues with conduit cracking and arcing due to high-bias power applications and cryogenic temperature processing, leading to reduced reliability and service life.
Innovation Solution
The use of ceramic material for fluid conduits and connectors within the substrate support assembly, which are designed to traverse powered and grounded regions, reduces arcing and cracking by providing electrical insulation and matching impedance, thereby enhancing the assembly's reliability and service life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional conduits are used to route coolant through powered and grounded regions, then the substrate support assembly can be cooled to cryogenic temperatures, but the conduits experience cracking due to high DC voltages and ohmic heating in high-bias RF power applications
Solution Approach 1:
The patent introduces an intermediary substance (electrically insulative coolant or coating) between the conductive conduit and the high-voltage RF field. This intermediary prevents direct interaction between the conduit and the harmful electromagnetic field, eliminating arcing and cracking while maintaining thermal conduction for cooling.
Solution Approach 2:
The patent changes the electrical parameters of the conduit system by introducing high electrical resistance through insulative coatings or selecting coolants with high resistivity. This parameter change transforms the conduit from being vulnerable to RF-induced cracking to being immune, while preserving the thermal conduction function for cryogenic cooling.
2Productivity
If conduits span powered and grounded regions in high-bias power applications, then coolant circulation is enabled for cryogenic processing, but parasitic current loss causes the conduits to crack
Solution Approach 1:
The insulative intermediary (coating or coolant) acts as a barrier that prevents parasitic current flow along the conduit surface. This eliminates energy loss through RF-induced currents while allowing the conduit to perform its primary function of transporting coolant for cryogenic processing.
Solution Approach 2:
The patent extracts the harmful electrical conductivity property from the conduit system by applying insulative coatings or selecting insulative coolants. This separation removes the source of parasitic current loss while preserving the essential thermal conduction function needed for cryogenic processing productivity.
3Power
If high-bias RF power is applied to the substrate support assembly, then processing power is increased, but the conduits experience higher ohmic heating and cracking
Solution Approach 1:
The insulative coating or coolant serves as a thermal and electrical intermediary that protects the conduit from direct exposure to high RF power. It prevents RF-induced ohmic heating by blocking the electromagnetic field interaction, allowing high power processing while maintaining conduit temperature within safe limits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic conduits and connectors effectively prevent arcing and cracking, improving the reliability and service interval of the substrate support assembly, allowing for reliable cryogenic temperature processing and reducing parasitic current loss and ohmic heating.
Implementation Method 1
the coolants must be sufficiently electrically insulative to prevent electrically shorting the substrate support assembly components to ground
Implementation Method 2
designed to traverse powered and grounded regions, reduces arcing and cracking by providing electrical insulation and matching impedance
Implementation Method 3
Operating a substrate support assembly to enable cryogenic temperature processing often relies on the use of coolants circulated through the substrate support assembly
Data Source
AI summary
A method and apparatus for cooling a semiconductor chamber are described herein. A semiconductor chamber component, includes a powered region, a grounded region, and a fluid conduit disposed within the semiconductor chamber component and passing through the powered region and grounded region, the fluid conduit comprising a ceramic material.