Ceramic Cooling Box With Integrated Metallization for Heat Dissipation
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Solution Overview
Problem
Current cooling solutions for electrical and electronic components face challenges in heat dissipation, reliability, and thermal shock resistance due to complex multi-material constructions and plane-parallel structures, which limit power density and increase the risk of thermal expansion-related issues.
Innovation Solution
A cooling box with a ceramic component and a metallization layer that acts as a circuit board, allowing for direct heat dissipation and improved thermal conductivity, combined with connectors for easy positioning and medium connection, enhancing thermal shock resistance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a multi-material construction with intermediate layers is used to transfer heat from power electronics modules, then heat dissipation is achieved, but the reliability and lifetime are reduced due to oxidation, burn-through, and aging of the intermediate layers
Solution Approach 1:
The invention extracts and eliminates the problematic intermediate layers (solders, conductive pastes, adhesives) from the heat transfer path. By using a ceramic substrate with integrated metallization layers that directly contact the heat-generating components, the patent removes the unreliable organic and metallic intermediate layers that cause oxidation, burn-through, and aging, while maintaining effective heat dissipation through the ceramic material's inherent thermal conductivity.
2Loss of energy
If numerous intermediate layers are used to transfer heat through planar structures, then heat dissipation is achieved, but the device complexity increases due to multiple error-prone processes
Solution Approach 1:
The invention merges the substrate function and heat dissipation function into a single integrated ceramic structure. The ceramic substrate incorporates metallization layers directly formed on its surface, combining what were previously separate components (substrate + multiple intermediate layers) into one unified structure. This integration eliminates the need for multiple assembly processes (gluing, pressing, screwing, soldering) and reduces device complexity while maintaining heat dissipation capability.
3Loss of energy
If organic and ceramic circuit carriers are attached to a metallic heat sink using additional measures, then heat dissipation is improved, but the multi-material construction becomes complex and compromises long-term reliability
Solution Approach 1:
The invention uses a composite ceramic substrate structure that integrates the benefits of both organic and ceramic materials while eliminating the need for additional attachment measures. The ceramic substrate provides thermal conductivity, electrical insulation, and mechanical stability in a single material system. The metallization layers are formed directly on the ceramic substrate through sintering or other integration processes, creating a homogeneous composite structure that avoids the complexity of attaching separate organic circuit carriers to metallic heat sinks with multiple intermediate layers.
4Loss of energy
If a plane-parallel structure is used for heat transfer, then heat dissipation occurs, but the thermal conductivity can only be used to a limited extent
Solution Approach 1:
The invention transitions from traditional plane-parallel heat transfer to a three-dimensional integrated structure. The ceramic substrate with its inherent thermal conductivity properties provides enhanced thermal pathways in multiple dimensions. The metallization layers are formed directly on the ceramic surface, creating direct thermal contact without the thermal resistance of intermediate layers, thereby maximizing the utilization of the ceramic material's thermal conductivity capabilities beyond what is achievable with plane-parallel structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced heat dissipation, improved reliability, and increased power density by integrating ceramic components with metallization layers for efficient thermal management and structural integrity, addressing the limitations of existing cooling technologies.
Implementation Method 1
at least one surface area of the cooling box is defined by the functions of the electrical conductivity and this surface area is conductor tracks
Implementation Method 2
cooling box for electrical or electronic components or circuits made of a material with thermal conductivity and this material consists of at least one ceramic component
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to a cooling box (1) for electric or electronic components, consisting of a material. Said cooling box (1) is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces and has a cavity (4) that is enclosed by the material, said cavity (4) being closed or provided with at least one opening (2). To improve thermal dissipation, at least one surface region of the cooling box (1) is defined by functions of electrical and/or thermal conductivity.