Ceramic Core Substrate With Built-In Inductor for Stable Interposers
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Solution Overview
Problem
Existing interposers face challenges in achieving high-density inductors with sufficient inductance per unit area and stable electrical characteristics, as the use of organic materials and dispersed magnetic particles limits permeability and increases variability in electrical characteristics.
Innovation Solution
A core substrate with a ceramic substrate, sintered metal conductor portions, and ceramic magnetic material portions, where the magnetic material is densely sintered to enhance permeability and the conductor is made of sintered metal to stabilize electrical characteristics, eliminating the use of resin-dispersed magnetic particles and plating films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If magnetic particles are dispersed in resin to form the magnetic material portion, then the inductor can be manufactured using conventional techniques, but the permeability is limited due to low filling factor of magnetic particles
Solution Approach 1:
The patent changes the physical state and density parameters of the magnetic material from dispersed particles in resin to densely sintered ceramic. This parameter change increases the filling factor from typical resin-dispersed values (usually <50%) to dense sintered values (>90%), thereby significantly improving permeability while maintaining manufacturability through established ceramic sintering processes
Solution Approach 2:
The patent uses composite materials by combining sintered metal conductor portions with sintered ceramic magnetic material portions. This composite approach allows the magnetic material to achieve high density and permeability through sintering, while the sintered metal conductor provides stable electrical characteristics, resolving the contradiction between ease of manufacture and reliability
2Ease of manufacture
If plating film is used for the conductor portion, then the inductor can be manufactured with conventional plating processes, but the electrical characteristics show high variation
Solution Approach 1:
The patent changes the conductor material from plating film to sintered metal. This parameter change transforms the conductor from a thin, variable-thickness plating layer to a dense, homogeneous sintered metal structure. The sintering process eliminates porosity and density variations inherent in plating, resulting in stable electrical characteristics while maintaining compatibility with conventional ceramic processing
Solution Approach 2:
The patent employs composite materials by using sintered metal for the conductor portion alongside sintered ceramic for the magnetic material portion. This composite approach ensures both portions are manufactured through compatible sintering processes, achieving uniform density and stable electrical characteristics throughout the inductor structure
3Area of moving object
If the size of the inductor is reduced to achieve high-density layout, then the footprint is reduced, but the inductance decreases due to reduced magnetic material volume
Solution Approach 1:
The patent changes the density parameter of the magnetic material from low-density resin-dispersed magnetic particles to high-density sintered ceramic. This parameter change allows the magnetic material to achieve much higher permeability in a smaller volume, enabling the inductor to maintain sufficient inductance while occupying less area for high-density layouts
Solution Approach 2:
The patent applies local quality by concentrating the magnetic material properties within the sintered ceramic structure. The sintering process creates a locally optimized high-permeability region that maximizes inductance generation within the available space, allowing reduced footprint without sacrificing inductance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for the construction of interposers with high inductance per unit area and stable electrical characteristics, reducing warpage and improving manufacturing yields while maintaining high permeability and low electrical loss.
Implementation Method 1
The conductor portion is made of sintered metal
Implementation Method 2
The magnetic material portion is made of ceramics
Implementation Method 3
the magnetic material is densely sintered to enhance permeability
Data Source
AI summary
A core substrate is a core substrate with a built-in inductor for constructing an interposer to which a semiconductor element is mounted. The core substrate includes: a ceramic substrate; a conductor portion; and a magnetic material portion. The ceramic substrate has a first surface, a second surface opposite the first surface in a thickness direction, and a through hole between the first surface and the second surface. The conductor portion extends through the through hole. The magnetic material portion surrounds the conductor portion within the through hole, and is made of ceramics. The conductor portion is made of sintered metal.


