Ceramic Capacitor Electrode Layout for Corner Moisture Sealing
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Solution Overview
Problem
Multilayer ceramic electronic components with reduced size and high capacitance face challenges in corner coverage performance and moisture resistance due to thin external electrodes, leading to potential plating solution permeation and degradation of product quality.
Innovation Solution
The design includes conductive layers on the corners of the ceramic body with a specific area ratio to the cross-sectional surface, covered by base electrodes to enhance corner coverage and prevent moisture permeation, thereby improving moisture resistance reliability and maintaining electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the external electrode thickness is reduced to achieve smaller component size, then the component size is reduced, but the corner coverage performance degrades and plating solution can permeate through the corner
Solution Approach 1:
The patent applies different thickness specifications to different regions of the external electrode. The band portion (central region) has a first thickness, while the corner portions have a second thickness that is greater than the first thickness. This local differentiation ensures that the corner portions provide adequate coverage and barrier function while the central band portion maintains reduced thickness for miniaturization.
2Quantity of substance
If the external electrode thickness is reduced to increase capacitance density, then the capacitance per volume is increased, but moisture resistance reliability deteriorates due to plating solution permeation
Solution Approach 1:
The external electrode is designed with non-uniform thickness where corner portions have increased thickness compared to the band portion. This local reinforcement at corners creates an enhanced barrier against plating solution permeation in the most vulnerable regions, thereby improving moisture resistance while maintaining high capacitance density through overall electrode thinning.
3Volume of moving object
If the cover layer thickness is reduced to achieve smaller component size, then the component size is reduced, but internal electrodes become exposed to physical and chemical impacts
Solution Approach 1:
The patent modifies the thickness parameter of the cover layer to an optimized value that balances miniaturization requirements with protective function. By precisely controlling the cover layer thickness, the design achieves smaller component size while ensuring internal electrodes remain adequately protected from external physical and chemical environments.
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic body; and first and second external electrodes disposed on the ceramic body, wherein the first and second external electrodes include first and second conductive layers disposed on corners of the ceramic body, and first and second base electrodes covering the first and second conductive layers, respectively, and wherein a ratio, A1/A2, of an area, A1, of the first conductive layer disposed on the fifth surface or the second conductive layer disposed on the sixth surface of the ceramic body to an area, A2, of a cross-sectional surface of the ceramic body taken in the second direction and the first direction is in a range of 0.1 to 0.3.