Multilayer Ceramic Component Covering Layer Formation
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Solution Overview
Problem
The existing method for manufacturing multilayer ceramic electronic components, which involves compressing a ceramic green sheet using a heating plate, results in deformation and makes it difficult to cut the sheet at the corners of the laminate, leading to challenges in processing.
Innovation Solution
A method that involves heating a functional sheet in contact with the laminate, cooling it, and then punching it out to form a covering layer, allowing for precise cutting at the corners without deformation, using thermoplastic resins with controlled softening temperatures to prevent damage during the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the ceramic green sheet is compressed by using a heating plate, then the ceramic green sheet is heated to be softened for bonding, but the ceramic green sheet is deformed making it hard to cut at the corner of the laminate
Solution Approach 1:
The patent applies preliminary action by heating and softening the functional sheet before punching, allowing the material to be more pliable and easier to cut precisely at the corners without deformation. The heating is performed as a preparatory step before the punching operation, enabling subsequent precise shaping.
Solution Approach 2:
The patent changes the temperature parameter of the functional sheet during processing. By heating the sheet to a specific temperature range, the material properties change to allow softening and deformation during punching, while controlled cooling afterward restores the material to its original state, enabling precise cutting edges.
2Ease of manufacture
If the functional sheet is heated to be softened for bonding, then bonding is facilitated, but the functional sheet becomes deformed and difficult to cut
Solution Approach 1:
The patent employs periodic action through controlled heating and cooling cycles. The functional sheet is heated to a specific temperature for a predetermined period to achieve softening for bonding, then cooled to restore rigidity for cutting. This time-controlled periodic process optimizes both bonding ease and subsequent processing efficiency.
Solution Approach 2:
The patent utilizes phase transitions of the thermoplastic resin in the functional sheet. By heating above the melting point of the thermoplastic resin, the material transitions from a rigid solid to a softened state for bonding. Subsequent cooling causes it to solidify again, enabling precise cutting. This controlled phase transition facilitates both bonding and processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate cutting of the functional sheet at the corners of the laminate, preventing deformation and ensuring precise formation of the covering layer, thereby improving the manufacturing efficiency and quality of multilayer ceramic electronic components.
Implementation Method 1
the functional sheet may be softened by heating a resin contained in the functional sheet
Implementation Method 2
cooling the heated functional sheet
Implementation Method 3
bonding the ceramic green sheet on the side surface of the laminate by using thermocompression bonding
Data Source
AI summary
A method for manufacturing a multilayer ceramic electronic component includes preparing a laminate including internal electrodes stacked through a ceramic green sheet, the internal electrodes being exposed on a surface of the laminate, heating a functional sheet while the functional sheet is in contact with a predetermined surface of the laminate, on which the internals electrode are exposed, cooling the heated functional sheet, and forming a covering layer formed of the functional sheet on the predetermined surface of the laminate by punching out the functional sheet having been cooled with the laminate.