Multilayer Ceramic Crack Guide Pattern Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic devices are vulnerable to physical and thermal impacts, leading to cracks that can render them non-functional, and existing solutions like external electrode structures with intermediate metal and polymer layers suffer from void formation and delamination during reflow or wave soldering, while reinforcing patterns increase manufacturing costs and reduce dielectric thickness.
Innovation Solution
A multilayer ceramic device with a crack guide pattern, comprising a metal pattern and an oxide layer, is integrated into the device body to redirect cracks from the circumferential surface to the sides, preventing them from reaching the active region, and the oxide layer's thickness is controlled to ensure proper adhesion and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a reinforcing pattern is provided within the device body to block crack progress, then crack resistance is improved, but the number of stacked patterns increases, leading to increased manufacturing cost and reduced dielectric thickness
Solution Approach 1:
A crack guide pattern consisting of a metal pattern with an oxide layer is introduced as an intermediary element. This pattern serves as a mediator that actively guides cracks along predetermined paths away from the active region, rather than passively blocking them. The oxide layer on the metal pattern creates a controlled interface that directs crack propagation, achieving crack resistance without increasing the number of functional dielectric stacks.
Solution Approach 2:
The crack guide pattern is segmented into a metal pattern with a specific oxide layer thickness (0.004 to 0.760 times the metal pattern thickness). This segmentation allows the pattern to be integrated into existing dielectric layers without adding complete additional stacks, thereby providing crack guidance functionality while minimizing impact on dielectric thickness and manufacturing complexity.
2Strength
If an external electrode structure with intermediate metal and polymer layers is used to absorb external impact, then impact absorption is improved, but void formation and delamination occur during reflow or wave soldering, reducing device function
Solution Approach 1:
The crack guide pattern uses a metal layer with a controlled oxide coating instead of a complex multi-layer polymer-metallizer structure. This simplified design eliminates the polymer resin component that causes void formation during soldering, providing a more reliable solution that maintains device function while still offering impact absorption through the metal pattern's structural design.
3Stability of the object's composition
If the oxide layer thickness on the metal pattern is too thin, then adhesion is insufficient causing delamination, but if too thick, then manufacturing complexity increases
Solution Approach 1:
The oxide layer thickness is precisely controlled within a specific range (0.004 to 0.760 times the metal pattern thickness). This parameter optimization ensures sufficient adhesion strength to prevent delamination during soldering processes while maintaining manufacturability. The defined ratio range provides a clear manufacturing specification that balances adhesion requirements with process simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The crack guide pattern effectively directs cracks to inactive regions, maintaining device functionality even under external impact, while optimizing manufacturing processes to avoid increased costs and dielectric thickness reduction.
Implementation Method 1
an oxide layer formed on a surface of the metal pattern
Data Source
AI summary
Disclosed herein is a multilayer ceramic device. The multilayer ceramic device according to an exemplary embodiment of the present invention includes: a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides; an internal electrode disposed in a longitudinal direction of the device body within the device body; an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, wherein the crack guide pattern includes: a metal pattern; and an oxide layer formed on a surface of the metal pattern.