Multilayer Ceramic Device Crack Prevention Reinforcement
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Solution Overview
Problem
Multilayer ceramic devices are vulnerable to cracks due to external physical or thermal shock, with cracks often starting from the surface adjacent to the external electrode and progressing into the device body.
Innovation Solution
A multilayer ceramic device structure incorporating a reinforcement pattern that extends from the lateral surface into the device body, with a length longer than the band portion of the external electrode, to prevent crack generation, while maintaining the device's capacitance characteristics by ensuring the reinforcement pattern's length is between 1:1 to 1:3.1 ratio with the band portion and is spaced apart from the internal electrode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the multilayer ceramic device is designed to improve device characteristics, then the device performance is enhanced, but the structure becomes vulnerable to external physical pressure or shock, thermal shock, and vibrations, leading to crack generation
Solution Approach 1:
The reinforcement pattern is formed in advance within the device body during the manufacturing process, creating a preventive structural feature that counteracts crack propagation before external shocks occur. This preliminary reinforcement structure extends from the lateral surface toward the interior, positioned to intercept cracks before they can compromise device integrity.
Solution Approach 2:
The reinforcement pattern is strategically positioned in specific regions where cracks are most likely to propagate, particularly near the external electrode interface. By concentrating reinforcement material in these critical zones rather than uniformly throughout the device, the structure achieves enhanced crack resistance while maintaining overall device performance characteristics.
2Strength
If a reinforcement pattern is added to prevent cracks, then the structural integrity is improved, but the device complexity increases
Solution Approach 1:
The reinforcement pattern is integrated into the existing manufacturing process by being formed simultaneously with the internal electrode through the same plating process. This merging of functions allows the reinforcement structure to be created without adding separate manufacturing steps, thereby reducing overall device complexity while still providing crack prevention benefits.
3Reliability
If the reinforcement pattern extends deeper into the device body, then the crack prevention capability is enhanced, but the manufacturing precision requirements increase
Solution Approach 1:
The reinforcement pattern's length is controlled within a specific ratio range (1:1 to 1:3.1) relative to the band portion width, providing an optimized balance between crack prevention effectiveness and manufacturing feasibility. This parameter specification allows for adequate crack interception capability while maintaining tolerance for normal manufacturing variations.
Data Source
AI summary
Disclosed herein is a multilayer ceramic device including a device body having lateral surfaces and circumferential surfaces connecting the lateral surfaces, an internal electrode disposed in a length direction of the device body within the device body, an external electrode having a front portion covering the lateral surface and a band portion extending from the front portion to cover a portion of the circumferential surface, and a reinforcement pattern extending from the lateral surface toward the interior of the device body and having a length longer than a width of the band portion.