Ceramic Electronic Component Interface With Cu Segregate Adhesion
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Solution Overview
Problem
The existing multilayer coil components exhibit poor adhesion between the base and the insulating film, which affects their performance and reliability.
Innovation Solution
Incorporating a ceramic base with a Cu element and an insulating film containing glass, along with a Cu segregate that contacts the base and insulating film at their interface, enhances the adhesion between the two layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional ferrite sintered body base is used with a glass-containing insulating layer, then the component structure is simple and easy to manufacture, but the adhesion between the base and the insulating layer is poor
Solution Approach 1:
A Cu segregate is introduced as an intermediary layer between the ferrite sintered body base and the glass-containing insulating film. The Cu segregate contains Cu elements that segregate to the surface during sintering, creating an intermediate zone that chemically bonds with both the base and the insulating film, thereby significantly improving adhesion
Solution Approach 2:
The Cu segregate is not uniformly distributed throughout the entire base, but is localized specifically at the surface region where the insulating film will be applied. This local concentration of Cu elements at the interface zone provides targeted adhesion enhancement without affecting the bulk properties of the base
2Reliability
If the adhesion between base and insulating film is improved by adding Cu segregate, then the reliability is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The Cu segregate forms automatically during the sintering process itself, without requiring separate manufacturing steps. The Cu elements present in the ferrite sintered body naturally segregate to the surface during sintering, creating the adhesion-promoting layer as a byproduct of the existing manufacturing process
Solution Approach 2:
By controlling sintering parameters such as temperature, atmosphere, and duration, the formation and distribution of Cu segregate can be optimized. The Cu content in the base and sintering conditions are adjusted to achieve the desired amount and distribution of Cu segregate at the surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the adhesion between the base and the insulating film, leading to enhanced performance and reliability of the electronic component.
Implementation Method 1
a Cu segregate containing a Cu element, wherein the Cu segregate is in contact with the base and the insulating film at an interface between the base and the insulating film
Data Source
AI summary
An electronic component includes a ceramic base containing a Cu element; an insulating film containing glass and at least partially covering a surface of the base; and a Cu segregate containing a Cu element. The Cu segregate is in contact with the base and the insulating film at an interface between the base and the insulating film.