Cylindrical Ceramic Detector Housing for EUV Thermal Management
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Solution Overview
Problem
Lithographic systems face challenges in accurately measuring and correcting wavefront aberrations in projection systems due to hostile environmental conditions, such as vacuum and heat, which affect signal quality and precision in EUV lithography.
Innovation Solution
A detector module with a cylindrical housing design that thermally couples electronic circuits close to detectors, using ceramic materials for heat conduction and electrostatic protection, and a cooling arrangement with a heat sink and gas-filled gap for efficient heat transfer and vibration mitigation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electronic circuits are placed close to detectors for signal preprocessing, then signal quality and noise reduction are improved, but heat generation and thermal expansion affect measurement precision
Solution Approach 1:
A heat-conductive housing made of ceramic material is introduced as an intermediary between the electronic circuit and the detector. The housing has a first portion in thermal contact with the detector and a second portion extending toward the electronic circuit, acting as a thermal bridge that conducts heat away from the detector while allowing the electronic circuit to remain close for signal preprocessing.
Solution Approach 2:
The patent replaces conventional cooling methods with a passive thermal conduction system using the ceramic housing. Instead of active cooling mechanisms, the housing itself serves as a heat sink through its inherent thermal conductivity, substituting mechanical cooling systems with a material-based thermal management solution.
2Temperature
If ceramic housing is used for thermal conduction, then heat management is improved, but electrostatic discharge risks increase
Solution Approach 1:
The housing is made of a composite or specially selected ceramic material that combines high thermal conductivity with electrostatic discharge protection properties. This composite material approach allows the housing to simultaneously achieve effective heat conduction while protecting against electrostatic discharge hazards.
3Measurement precision
If vacuum environment is used for EUV lithography, then radiation precision is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The ceramic housing acts as an intermediary thermal management system that operates effectively in vacuum environments. It provides a thermal conduction path that does not rely on convection or conduction through air, making it suitable for vacuum-based EUV lithography while maintaining heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate optical measurements and reduces noise and thermal expansion, maintaining positional accuracy and protecting against electrostatic discharges, while efficiently managing heat and vibrations in the detector module.
Implementation Method 1
the at least partially cylindrical part of the first body is thermally coupled with the at least partially cylindrical part of the second body
Implementation Method 2
a cooling arrangement with a heat sink and gas-filled gap for efficient heat transfer and vibration mitigation
Data Source
AI summary
A detector module (20) is described that includes at least one detector (30) for sensing photon radiation, an electronic circuit (40) coupled to the at least one detector (30), and a housing (50) having a first and a second body (60, 70), each having a bottom part (62, 72) and an at least partially cylindrical part (64, 74) extending from the bottom part (62, 72), wherein the at least partially cylindrical part (64) of the first body (60) is thermally coupled with the at least partially cylindrical part (74) of the second body (70), wherein the at least partially cylindrical part (64) of the first body (60) extends towards the bottom part (72) of the second body (70), and wherein the electronic circuit (40) is arranged inside the housing (50). A lithographic apparatus including the detector module (20) is also described.