Ceramic Electronic Device Corner Plating for Humidity Resistance

The patent applies local quality by making the ground layer thickness non-uniform: thicker at corner portions (10 μm or more) to ensure coverage and humidity resistance, and thinner at other areas to minimize overall device size. This spatial variation in thickness optimizes both protection and compactness.

The patent changes the thickness parameter of the ground layer from a uniform value to a variable value that depends on position. Specifically, the thickness is set to 10 μm or more at corner portions and 5 μm or less at other portions, creating a gradient structure that balances protection and size.

The patent uses local quality by applying different thickness requirements to different regions: corner portions require 10 μm or more to ensure continuous coverage and eliminate discontinuities, while other areas use 5 μm or less to simplify manufacturing and reduce material usage.

The patent applies partial action by providing excessive thickness (10 μm or more) only where absolutely necessary (corner portions prone to discontinuities), rather than uniformly throughout the entire ground layer. This targeted approach ensures continuity where needed while avoiding unnecessary complexity elsewhere.

The patent applies local quality by varying the plated layer thickness according to position: the plated layer is made thicker at corner portions where the ground layer has larger spaced distances, and thinner in other areas. This ensures adequate coverage where needed while minimizing material consumption.

The patent changes the plated layer thickness parameter from uniform to variable, adjusting it based on the underlying ground layer structure and the spaced distance that needs to be covered. This optimized parameter distribution achieves necessary coverage with reduced material usage.