Ceramic Electronic Device Gap Control for Crack Prevention
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Solution Overview
Problem
Ceramic electronic devices, such as multilayer ceramic capacitors, face issues with cracking due to low material filling density caused by large insulation gaps formed during the firing or reflow process, which can lead to deteriorated insulation characteristics.
Innovation Solution
A ceramic electronic device with a multilayer structure featuring a conductive layer spaced from the internal electrode layer by a gap of 30 μm or less, and alternately shifted positions of adjacent gaps to reduce low-density sections, preventing crack formation during thermal processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If large insulation space is formed between external electrodes to ensure insulation, then insulation characteristic is improved, but material filling degree becomes low causing crack occurrence
Solution Approach 1:
The patent changes the critical parameter from gap length to gap density by reducing the gap length to 30 μm or less. This parameter change allows the insulation space to maintain adequate insulation while significantly reducing the volume of low-density sections, thereby preventing cracks during thermal processes while preserving insulation characteristics.
2Reliability
If insulation space larger than electrode paste thickness is formed, then insulation characteristic is improved, but low density section is formed reducing structural integrity
Solution Approach 1:
The patent applies parameter changes by precisely controlling the gap length to 30 μm or less, transforming the insulation space from a large-volume weak structure into a compact insulation barrier that maintains both electrical insulation and structural strength.
3Reliability
If steps are buried by electrode paste, then external electrode insulation is achieved, but large insulation space is required creating low density section
Solution Approach 1:
The patent changes the insulation space dimension parameter to an extremely small scale (30 μm or less), which allows electrode paste to effectively bury steps and form insulation without creating significant low-density sections, thereby improving material filling degree while maintaining insulation.
Data Source
AI summary
A ceramic electronic device includes a multilayer structure having a parallelepiped shape in which a first dielectric layer of which a main component is ceramic, a first internal electrode layer, a second dielectric layer of which a main component is ceramic, and a second internal electrode layer are stacked in this order, the first internal electrode layer being exposed to a first end face of the parallelepiped shape, the second internal electrode layer being exposed to a second end face of the parallelepiped shape, wherein in the multilayer structure, a conductive layer is provided on a side of the first end face, at a same level in a stacking direction as the second internal electrode, the conductive layer being spaced from the second internal electrode layer. A length of a gap between the second internal electrode layer and the conductive layer is 30 μm or less.