Diamond-Particle Ceramic Channels for Heat Dissipation Bottlenecks
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Solution Overview
Problem
Devices that generate heat, such as electronics and laser systems, face challenges in effectively dissipating heat, leading to potential danger and impaired functionality if heat management is inadequate.
Innovation Solution
A heat management system comprising a ceramic body with a network of channels filled with a material containing diamond particles, which has a higher thermal conductivity than the ceramic body, and optionally includes extension components, to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional ceramic materials are used for heat management, then the device structure can be simple and manufacturing can be easier, but the thermal conductivity is insufficient leading to inadequate heat dissipation
Solution Approach 1:
The patent applies composite materials by combining diamond particles with ceramic matrix (such as silicon carbide or aluminum oxide) to create a composite ceramic material. The diamond particles provide high thermal conductivity pathways while the ceramic matrix maintains structural integrity, achieving superior heat dissipation compared to conventional单一陶瓷 materials.
Solution Approach 2:
The patent implements local quality by creating regions with different diamond particle concentrations within the ceramic body. Areas with higher heat generation are provided with higher concentrations of diamond particles to maximize thermal conductivity where needed, while other regions maintain lower concentrations to optimize other properties.
2Temperature
If diamond particles are added to enhance thermal conductivity, then heat dissipation improves, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The patent applies preliminary action by pre-distributing diamond particles throughout the ceramic matrix before final sintering or consolidation. This pre-distribution ensures uniform thermal conductivity throughout the material and simplifies the subsequent manufacturing steps compared to attempting to add diamond particles after the ceramic is fully formed.
Solution Approach 2:
The patent utilizes parameter changes by controlling the size, shape, and concentration of diamond particles during manufacturing. By optimizing these parameters, the patent achieves high thermal conductivity while maintaining manufacturability through standardized particle sizes that are compatible with conventional ceramic processing techniques.
3Temperature
If a network of channels with high thermal conductivity material is implemented, then heat transfer efficiency increases, but the device structure becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the heat management system into a network of discrete channels or pathways within the ceramic body. Each channel acts as an independent heat transfer pathway, allowing heat to be distributed and managed through multiple routes, which improves overall heat transfer efficiency while maintaining a manageable structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently transfers and dissipates heat generated by heat-generating devices, ensuring safer and more reliable operation by effectively managing thermal energy.
Implementation Method 1
a material having a higher thermal conductivity than the ceramic body and including a plurality of diamond particles
Data Source
AI summary
The present disclosure is directed to a heat management system that includes a ceramic body and a material having a higher thermal conductivity than the ceramic body, the material including a plurality of diamond particles. The material is arranged in a network of channels defined in a surface of the ceramic body and/or forms an extension component attached to the ceramic body.