Ceramic Electronic Component Dielectric Composition for Mounting Stress
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Solution Overview
Problem
Ceramic electronic components with external electrodes only on the mounting surface are prone to damage and corner chipping due to stress during mounting, and have a large area requirement for external electrodes.
Innovation Solution
A ceramic electronic component design with internal electrodes and dielectric layers containing group 14 and group 2 elements, where the concentration ratio of these elements varies across different dielectric regions to enhance toughness and hardness, allowing for reduced external electrode area while maintaining reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If external electrodes are provided substantially only on the mounting surface of a ceramic electronic component, then the area needed for external electrodes is reduced, but the element body is likely to be damaged by stress applied through the external electrodes during mounting and the upper corners are exposed and likely to be chipped
Solution Approach 1:
The dielectric is designed with non-uniform composition: bottom dielectric regions adjacent to the mounting surface have a higher ratio of group 14 elements to group 2 elements compared to top dielectric regions, creating localized differences in mechanical properties to handle stress concentration at specific locations
Solution Approach 2:
The patent changes the chemical composition parameters of the dielectric by varying the concentration ratio of group 14 elements (Si, Ge, Sn, Pb) to group 2 elements (Be, Mg, Ca, Sr, Ba) across different regions, thereby adjusting local mechanical properties such as toughness and hardness to resolve the contradiction between electrode area reduction and reliability maintenance
2Productivity
If external electrodes are provided substantially only on the mounting surface, then mounting density is improved, but corner chipping occurs due to exposed upper corners
Solution Approach 1:
Top dielectric regions are designed with a lower ratio of group 14 elements to group 2 elements compared to bottom regions, creating localized high hardness properties specifically at the upper corners to prevent chipping while maintaining the overall compact design for high mounting density
Solution Approach 2:
By adjusting the chemical composition parameters of the dielectric material - specifically the ratio of group 14 elements to group 2 elements - the patent creates regional variations in mechanical properties that protect exposed corners from chipping while enabling compact component design for improved mounting density
Data Source
AI summary
A ceramic electronic component includes an element body including a first internal electrode, a second internal electrode disposed in parallel to the first internal electrode, and a dielectric interposed between the first and second internal electrodes and surrounding them, and external electrode electrically connected to ends of the internal electrodes. The element body has a bottom surface on which respective ends of the first and second internal electrodes are exposed and a top surface. The dielectric has bottom dielectric regions adjacent to the bottom surface, a top dielectric region adjacent to the top surface, and a middle height dielectric region disposed between the bottom and top dielectric region. The bottom dielectric regions have a ratio of the concentration of one or more group 14 elements to the concentration of one or more group 2 elements that is higher than that in the top dielectric region.