Ceramic Electronic Component Diffusion Layer Crack Resistance

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Solution Overview

Problem

Ceramic electronic components face issues with mechanical strength due to insufficient firing of the outermost ceramic layer, leading to cracking, and surface leakage current problems exacerbated by miniaturization, with existing solutions being cumbersome and ineffective in preventing cracking and leakage.

Innovation Solution

A diffusion layer made of an oxide into which elements from the ceramic body are diffused, located closer to the surface than the outermost internal electrode layer, providing enhanced mechanical strength, moisture resistance, and suppression of surface leakage current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the outermost ceramic layer is fired insufficiently to maintain basic ceramic structure, then the firing process is simpler and faster, but the mechanical strength decreases and cracking occurs easily

Engineering Contradiction:
Improvefiring process efficiencyVSAvoidmechanical strength of ceramic body
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The patent divides the ceramic body into two functional zones: an inner ceramic layer and an outer glass layer. The inner ceramic layer is fired to establish the basic ceramic structure, while the outer glass layer is applied afterward to provide mechanical strength and prevent cracking. This segmentation allows each layer to be optimized independently for its specific function.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates a composite structure by combining ceramic material in the inner layer with glass material in the outer layer. The glass layer contains specific oxide components (SiO2, B2O3, Al2O3, etc.) that provide enhanced mechanical strength and crack resistance. This composite approach allows the ceramic body to achieve both structural integrity and surface protection.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the entire outer surface is coated with oxide glass and then polished to expose terminal electrodes, then cracking resistance improves, but the manufacturing process becomes cumbersome and complicated

Engineering Contradiction:
Improvecracking resistanceVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The glass layer is applied to the green chip (before firing) rather than to the fired ceramic body. This preliminary action allows the glass to be incorporated into the firing process itself, eliminating the need for separate coating and polishing steps. The glass layer is formed in advance and then fired together with the ceramic, simplifying the overall manufacturing process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The glass layer serves multiple functions simultaneously: it provides mechanical strength, prevents cracking, and acts as a protective coating during the firing process. The firing process itself serves to both sinter the ceramic and fuse the glass layer, eliminating the need for separate operations. The structure is self-reinforcing, with the glass layer naturally adhering to and protecting the ceramic body.

Inventive Principle:
Principle #25Self-service

3Length of moving object

If the ceramic body surface is exposed between terminal electrodes to reduce distance, then miniaturization and slimming down are achieved, but surface leakage current increases when impurities adhere to the surface

Engineering Contradiction:
Improvedistance between terminal electrodesVSAvoidsurface leakage current
Core Design Contradiction:
Length of moving objectVSObject-affected harmful factors

Solution Approach 1:

The glass layer is applied selectively to specific regions of the ceramic body surface, particularly in areas where impurity adhesion would cause leakage current between terminal electrodes. This local quality approach allows the exposed ceramic surface between terminals to be minimized while still providing glass protection where needed. The glass layer's composition and distribution are optimized for local electrical insulation requirements.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The glass layer acts as an intermediary barrier between the ceramic body surface and environmental impurities. It prevents impurities from adhering to the ceramic surface in critical areas, thereby blocking the pathway for surface leakage current. The glass layer mediates the interaction between the ceramic and the external environment, providing electrical insulation while allowing the ceramic structure to maintain its miniaturized dimensions.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The diffusion layer effectively prevents cracking, improves moisture resistance, and suppresses surface leakage current, maintaining desired electrical properties while being easier to implement than existing methods.

Implementation Method 1

the diffusion layer is an oxide layer into which at least a part of elements contained in the ceramic body are diffused

Methodology Applied
Scientific EffectDiffusion: Diffusion

Implementation Method 2

the ceramic body has to be provided with such a surface property that an impurity hardly adheres thereto

Methodology Applied
Scientific EffectAdsorption: Adsorption

Data Source

PatentUS7751176B2Ceramic electronic component
Publication Date: 2010.07.06 TDK CORP
  • US7751176B2 patent drawing
  • US7751176B2 patent drawing

AI summary

A ceramic electronic component includes a ceramic body and an internal electrode layers disposed within the ceramic body. The ceramic body is covered with a diffusion layer, wherein said diffusion layer is an oxide layer into which at least a part of elements contained in the ceramic body are diffused and is located closer to a surface of the ceramic body than an outermost internal electrode layer.