Ceramic-Coated Chamber Member for Plasma-Damaged Edge Protection
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Solution Overview
Problem
Semiconductor manufacturing apparatus members face challenges in reducing particle generation due to plasma damage, particularly at the edge portions of the base, which affects the yield and durability of semiconductor devices.
Innovation Solution
A semiconductor manufacturing apparatus member is designed with a base having a particle-resistant layer that includes a polycrystalline ceramic, where the edge portion is covered with a first particle-resistant layer with higher resistance than the second layer on the surface, reducing plasma damage and enhancing overall particle resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal-sprayed film is formed on the front surface of the base, then plasma resistance is improved, but cracks and peeling occur in the film reducing durability
Solution Approach 1:
The invention changes the material parameters by replacing the thermal-sprayed yttria film with an amorphous ceramic film formed by aerosol deposition. This material substitution eliminates the cracking and peeling issues while maintaining plasma resistance, thus resolving the contradiction between reliability and durability.
Solution Approach 2:
The invention uses a composite structure consisting of a base and an amorphous ceramic film layer. This composite material approach provides both the plasma resistance needed for reliability and the structural integrity required for durability, preventing the film defects that occur with thermal-sprayed coatings.
2Ease of manufacture
If a uniform particle-resistant layer is provided on all surfaces, then manufacturing simplicity is maintained, but plasma damage at edge portions cannot be sufficiently reduced
Solution Approach 1:
The invention applies different particle-resistant layers with different properties to different locations: a first particle-resistant layer with higher particle resistance at the edge portion and a second particle-resistant layer with lower particle resistance on the surface. This local differentiation optimizes plasma damage protection at the vulnerable edge while maintaining overall manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces plasma damage at the edge portions and improves the particle resistance of the semiconductor manufacturing apparatus member, leading to higher yields and improved durability of semiconductor devices.
Implementation Method 1
the front surface of the semiconductor manufacturing apparatus member is coated with a covering film (layer) having excellent plasma resistance
Data Source
AI summary
According to one embodiment, a semiconductor manufacturing apparatus member includes a base and a particle-resistant layer. The base includes a first surface, a second surface crossing the first surface, and an edge portion connecting the first surface and the second surface. The particle-resistant layer includes a polycrystalline ceramic and covering the first surface, the second surface, and the edge portion. The particle-resistant layer includes a first particle-resistant layer provided at the edge portion, and a second particle-resistant layer provided at the first surface. A particle resistance of the first particle-resistant layer is higher than a particle resistance of the second particle-resistant layer.