Ceramic Edge Ring Temperature Control for Stable Plasma Sheath
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Solution Overview
Problem
Temperature differentials between components in substrate processing systems cause non-uniform chemical reactions and process drift due to varying RF power usage, leading to inefficiencies in substrate processing.
Innovation Solution
A substrate processing kit featuring a ceramic ring with embedded chucking electrodes and a heating element, thermally isolated from the cooling plate, allowing independent temperature control and maintaining a stable sheath profile during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the edge ring and dielectric plate are thermally coupled, then structural stability is improved, but temperature uniformity deteriorates causing process drift
Solution Approach 1:
The substrate support structure is segmented into thermally independent zones: the dielectric plate with its cooling plate forms one thermal zone, while the edge ring with its separate cooling plate forms an independent thermal zone. This segmentation allows each component to be temperature-controlled independently, preventing temperature differentials that would cause thermal distortion while maintaining structural stability through mechanical coupling.
2Productivity
If RF power is applied to the cooling plate for substrate processing, then etching performance is improved, but temperature control precision deteriorates due to heating of the edge ring
Solution Approach 1:
The cooling system is segmented into two independently controlled cooling plates: one coupled to the dielectric plate and another coupled to the edge ring. This allows independent temperature management where RF power can be applied for etching while the edge ring's cooling plate actively removes generated heat, preventing temperature drift that would compromise manufacturing precision.
Solution Approach 2:
The separate cooling plate for the edge ring acts as a thermal intermediary that decouples the thermal effects of RF processing from the edge ring structure. This intermediary cooling system absorbs and removes heat generated during RF-powered etching, maintaining temperature control precision independent of the processing power applied to the substrate.
3Duration of action of moving object
If the edge ring height decreases due to ion bombardment, then substrate processing continues, but sheath profile uniformity deteriorates causing process drift
Solution Approach 1:
The edge ring's vertical position is made dynamically adjustable rather than fixed. A positioning mechanism allows the edge ring to be vertically adjusted to compensate for height reduction from ion bombardment during prolonged processing. This dynamic adjustment maintains the sheath profile uniformity and equipotential lines, preventing process drift even during extended substrate processing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The kit ensures uniform chemical reactions and reduces process drift by maintaining independent temperature control of the ceramic ring and substrate support, enhancing processing consistency and efficiency.
Implementation Method 1
a process kit having a ceramic ring with a chucking electrode disposed in the ceramic ring and a heating element disposed in the ceramic ring
Implementation Method 2
An electrostatic chuck is used to electrostatically hold a substrate to control substrate temperature during processing
Implementation Method 3
a cooling plate disposed below the dielectric plate
Data Source
AI summary
Embodiments of a process kit are provided herein. In some embodiments, a process kit for use in a substrate processing chamber includes: a ceramic ring having an upper surface and a lower surface, wherein the ceramic ring includes a chucking electrode disposed in the ceramic ring and a heating element disposed in the ceramic ring; and an edge ring disposed on the ceramic ring.