Ceramic Component Electrode Alloy Particle Adhesion

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Solution Overview

Problem

Ceramic electronic components face issues with low adhesion between conductive layers, leading to easy detachment and potential damage from drop impacts and thermal cycles, particularly in mobile devices and in-vehicle equipment.

Innovation Solution

A ceramic electronic component with an outer electrode comprising a first conductive layer containing a resin and a second metal component with a higher melting point, along with alloy particles protruding from the first conductive layer, which are heated to form a strong bond with a plating film in the second conductive layer, enhancing mechanical durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a thermosetting conductive paste containing metal powder and resin is used to form the first conductive layer, then the ceramic electronic component can withstand drop impacts and thermal cycles, but the adhesion between the first conductive layer and the second conductive layer becomes low, causing easy detachment

Engineering Contradiction:

Improvemechanical durabilityVSAvoidadhesion between conductive layers

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies local quality by creating alloy particles with specific composition (Sn and Ag) at specific locations (protruding from the first conductive layer surface) to enhance adhesion. The alloy particles are formed locally through selective heating at 480-800°C, creating regions of high adhesion strength where needed most for bonding the second conductive layer.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes the physical and chemical parameters of the conductive layer by heating the electrode layer to 480-800°C in a non-oxidative atmosphere. This temperature range is specifically chosen to melt the low-melting-point metal powder (Sn) while maintaining the structural integrity of the resin, transforming the material state to form protruding alloy particles that enhance adhesion.

Inventive Principle:

Principle #35Parameter changes

2Strength

If the electrode layer is heated to form alloy particles, then adhesion between conductive layers is improved, but the heating process requires precise temperature control to avoid resin degradation

Engineering Contradiction:

Improveadhesion between conductive layersVSAvoidheating process control

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-forming the electrode layer with specific metal powder and resin composition before heating. The metal powder is selected with a melting point lower than the resin's degradation temperature, so that when heating occurs, the metal melts first to form the adhesion-enhancing alloy particles before any resin degradation can occur.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent utilizes phase transitions by heating the electrode layer to a temperature range (480-800°C) that causes the low-melting-point metal powder to transition from solid to liquid state, forming alloy particles that protrude from the conductive layer. This controlled phase transition occurs below the resin's degradation temperature, ensuring structural integrity while achieving the desired adhesion enhancement.

Inventive Principle:

Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly increases the mechanical durability and adhesion between conductive layers, preventing detachment and damage from physical impacts and thermal cycles, while also improving the rigidity and moisture resistance of the ceramic component.

Implementation Method 1

a heating step of heating the electrode layer is performed to form a first conductive layer including an alloy particle that contains the first metal component and the second metal component and protrudes from a surface of the first conductive layer

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 2

An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS8988855B2Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle

Publication Date: 2015.03.24 MURATA MFG CO LTD

AI summary

A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.