Ceramic Outer Electrode Barrier Layer Against Plating Infiltration
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Solution Overview
Problem
Ceramic electronic components face reduced heat resistance and moisture resistance due to the infiltration of plating solutions into the base electrode layer during the plating process, especially in miniaturized and highly functionalized chip components.
Innovation Solution
Incorporating a SiO2—BaO—B2O3—CaO-based glass into the base electrode layer and applying a protective layer containing elements like P, S, C, Si, Ba, F, N, Al, or B to prevent plating solution infiltration, followed by a Ni plating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating process is performed to form an outer electrode on a ceramic body, then the electrical connection and solder protection are improved, but the plating solution infiltrates into the base electrode layer causing reduced heat resistance and moisture resistance
Solution Approach 1:
A protective layer is introduced as an intermediary between the base electrode layer and the plating solution. This protective layer acts as a barrier that prevents the plating solution from infiltrating into the base electrode layer, while still allowing the plating process to proceed effectively on the outer surface.
Solution Approach 2:
The base electrode layer is formed as a composite material containing conductive metal particles and glass particles. This composite structure provides both the necessary electrical conductivity and a matrix that can be protected from plating solution infiltration when combined with the protective layer.
2Volume of moving object
If the outer electrode is thinned to enable miniaturization of chip components, then the component size is reduced, but the heat resistance decreases due to increased vulnerability to plating solution infiltration
Solution Approach 1:
A thin protective layer is applied to the base electrode layer to provide protection against plating solution infiltration. This thin film approach allows miniaturization to proceed while maintaining heat resistance, as the protective layer is sufficiently thin to accommodate small component sizes yet thick enough to provide effective protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents plating solution infiltration, enhancing the heat resistance and moisture resistance of ceramic electronic components while maintaining high reliability and miniaturized component sizes.
Implementation Method 1
a protective layer covering a surface of the SiO2—BaO—B2O3—CaO-based glass exposed on a surface of the base electrode layer
Data Source
AI summary
A ceramic electronic component includes a ceramic body including an internal electrode layer, and an outer electrode on a surface of the ceramic body and electrically connected to the internal electrode layer. The outer electrode includes a base electrode layer including a SiO2—BaO—B2O3—CaO-based glass, a protective layer covering a surface of the SiO2—BaO—B2O3—Cao-based glass exposed on a surface of the base electrode layer and including at least one of P, S, C, Si, Ba, F, N, Al, Sr, or B, and a Ni plating layer covering the base electrode layer and the protective layer.