Multilayer Ceramic Component Electrode Bend Elimination
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Solution Overview
Problem
Multilayer ceramic electronic components with thin ceramic layers and a large number of stacked layers suffer from low electrical strength due to bends in internal electrodes, which concentrate electric fields and reduce capacitance.
Innovation Solution
The design eliminates bends in internal electrodes by ensuring they are not exposed to certain surfaces and includes saddles that prevent delamination, maintaining a flat interface for increased electrical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the ceramic layer is thinned and the number of stacked layers is increased to achieve large capacitance within predetermined dimensions, then the capacitance increases, but the electrical strength decreases
Solution Approach 1:
The patent applies parameter changes by carefully controlling the thickness of the ceramic layer (1 μm or less) and the grain size of barium titanate (1 μm or less) while adjusting the number of stacked layers to achieve the desired capacitance. This optimization of physical parameters allows high capacitance while maintaining electrical strength through precise control of material properties and structural dimensions.
Solution Approach 2:
The patent uses composite materials by combining barium titanate ceramic with specific binder materials and conductive paste compositions. The dielectric layer comprises barium titanate particles with specific size distribution combined with binder materials, creating a composite structure that maintains high electrical strength even when the ceramic layer is thinned and the number of layers is increased.
2Quantity of substance
If the ceramic layer is thinned and the number of stacked layers is increased, then the capacitance increases, but the structural defects increase
Solution Approach 1:
The patent controls critical parameters including ceramic layer thickness (1 μm or less), grain size (1 μm or less), and the number of stacked layers (up to 1,000 layers). By optimizing these parameters within specific ranges, the patent achieves high capacitance while minimizing structural defects such as cracks and delamination that typically occur in thin-layer, high-stack configurations.
Solution Approach 2:
The patent employs beforehand cushioning by carefully designing the binder material composition and conducting pre-sintering treatments to prevent structural defects before they occur. The binder material is specifically formulated to maintain structural integrity during the stacking process, and pre-sintering is performed to eliminate potential defects before final sintering, thereby preventing cracks and delamination in advance.
3Quantity of substance
If the internal electrodes are made smooth and have wide coverage to achieve large capacitance, then the capacitance increases, but the manufacturing complexity increases
Solution Approach 1:
The patent optimizes the thickness of the internal electrodes and their coverage area as key parameters. By controlling the electrode thickness and coverage within specific ranges, the patent achieves wide coverage and smooth electrodes for high capacitance while maintaining manufacturing feasibility. The conductor paste composition and printing parameters are also optimized to produce smooth electrodes without excessive manufacturing complexity.
Data Source
AI summary
A multilayer ceramic electronic component that is small, that has high electrical strength, and that is resistant to separation between ceramic layers includes a ceramic sintered body having a substantially rectangular parallelepiped shape and a plurality of first and second internal electrodes. The plurality of first and second internal electrodes are alternately arranged so as to face each other. The first and second internal electrodes are parallel or substantially parallel to first and second major surfaces. The first and second internal electrodes are exposed to at least one of the fifth and sixth surfaces and are not exposed to the third or fourth surface. No bends exist in any of the ends of each of the first and second internal electrodes adjacent to the third and fourth surfaces.