Multilayer Ceramic Component Electrode Deformation Control
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Solution Overview
Problem
The challenge in fabricating multilayer ceramic electronic components with thin layers is the deformation of internal electrodes, leading to defects such as short-circuits and reduced reliability, particularly when using fine barium titanate particles that require increased binder content for film strength.
Innovation Solution
A multilayer ceramic electronic component with internal electrode patterns and dielectric patterns formed using ceramic powders of specific particle sizes, where the dielectric patterns enclose the internal electrodes to prevent deformation, and a fabricating method involving a thermal transfer process at low temperature and pressure to stack ceramic sheets with thicknesses of 1 μm or less, using ceramic pastes with ethylcellulose and polyvinyl butyral as organic binders.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If fine barium titanate particles are used to fabricate thin ceramic green sheets, then high capacitance and compactness are achieved, but film strength deteriorates leading to internal electrode deformation and short-circuit defects
Solution Approach 1:
The patent uses a composite binder system comprising ethylcellulose and polyvinyl butyral in specific ratios (ethylcellulose: 5-15 wt%, polyvinyl butyral: 85-95 wt%) to create a ceramic green sheet that maintains both thinness (1 μm or less) and sufficient film strength. This composite material approach allows the use of fine barium titanate particles (average particle size 0.1-10 μm) without causing electrode deformation.
Solution Approach 2:
The patent optimizes the binder content to 10-30 wt% of the total ceramic paste composition and controls the organic solvent evaporation rate during the drying process. By adjusting these parameters, the green sheet achieves adequate mechanical strength at ultrathin dimensions (1 μm or less) while maintaining high capacitance through fine particle usage.
2Strength
If binder content is increased to secure film strength of thin ceramic green sheets, then film strength is improved, but internal electrode deformation occurs causing defects and short-circuits
Solution Approach 1:
The patent precisely controls the binder content within 10-30 wt% and the ratio between ethylcellulose and polyvinyl butyral to achieve optimal film strength without excessive binder. This parameter optimization prevents internal electrode deformation while maintaining green sheet integrity during the stacking and firing processes.
Solution Approach 2:
The patent applies different binder compositions to different regions of the ceramic paste: ethylcellulose provides structural framework in areas requiring strength, while polyvinyl butyral ensures uniform distribution and adhesion. This localized quality approach maintains electrode precision while achieving sufficient film strength.
3Quantity of substance
If ceramic green sheets are stacked in large amounts to achieve high capacitance, then capacitance is improved, but the complexity of the fabrication process increases
Solution Approach 1:
The patent achieves high capacitance by increasing the number of stacked layers (typically 10-100 layers or more) while maintaining each layer at ultrathin dimensions (1 μm or less). The standardized ceramic paste formulation with optimized binder content simplifies the fabrication process, allowing consistent production of thin green sheets that can be stacked in large quantities without proportionally increasing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of the multilayer ceramic components by reducing the rate of short-circuit defects and maintaining structural integrity, achieving high capacitance and compactness while preventing electrode deformation during the stacking and compressing processes.
Implementation Method 1
an organic binder including ethylcellulose and polyvinyl butyral
Implementation Method 2
a fabricating method involving a thermal transfer process at low temperature and pressure to stack ceramic sheets
Data Source
AI summary
There are provided a multilayer ceramic electronic component and a fabricating method thereof. The multilayer ceramic electronic component includes: a multilayer ceramic body including a first ceramic powder and having a plurality of ceramic sheets stacked therein, each ceramic sheet having a thickness of 1 μm or less; internal electrode patterns formed on the plurality of ceramic sheets; and dielectric patterns formed on the ceramic sheets to enclose the internal electrode patterns, the dielectric patterns including a second ceramic powder having a particle size smaller than that of the first ceramic powder and each having a thickness equal to or thinner than that of each of the internal electrode patterns.