Ceramic Electronic Component Electrode Peeling Prevention
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Solution Overview
Problem
The existing method of forming a plating layer on a ceramic body through a base layer in multi-layer ceramic capacitors often results in peeling issues due to surface roughness discrepancies, leading to potential decreases in moisture resistance and reliability.
Innovation Solution
A ceramic electronic component with external electrodes featuring base layers and plating layers, where blast polishing is used to uniformly grind the base layers and maintain a surface roughness difference of 40 nm or less between the base layers and the ceramic body's intermediate region, reducing the contact angle and preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating layer is formed on a ceramic body through a base layer by conventional methods, then the external electrode structure is created, but surface roughness discrepancies cause peeling of the plating layer
Solution Approach 1:
The patent applies preliminary action by performing blast polishing on the ceramic body surface before forming the base layer and plating layer. This pretreatment creates a uniformly smooth surface that prevents subsequent peeling issues, addressing the surface roughness problem before the plating process begins.
Solution Approach 2:
The patent changes the surface roughness parameter of the ceramic body through blast polishing, reducing it to a specific range (Ra: 0.03-0.5 μm). This parameter change ensures uniform surface properties that prevent peeling while maintaining manufacturing feasibility.
2Reliability
If the surface roughness difference between base layer and ceramic body is large, then the base layer can be formed, but the contact angle increases causing peeling of the external electrode
Solution Approach 1:
The patent performs blast polishing as a preliminary action to uniformize the surface roughness of the ceramic body before base layer formation. This ensures that when the base layer is applied, the underlying surface has consistent roughness characteristics, preventing excessive contact angles and subsequent peeling.
Solution Approach 2:
The patent controls the surface roughness parameter through blast polishing, maintaining the difference between base layer and ceramic body surface roughness within a specific range. This parameter control ensures optimal bonding strength while preventing peeling failures.
3Reliability
If blast polishing is performed to reduce surface roughness difference, then peeling is suppressed and solder wettability improves, but additional processing steps are required
Solution Approach 1:
The patent incorporates blast polishing as a preliminary step in the manufacturing process, performing surface uniformization before base layer and plating layer formation. While this adds a processing step, it prevents subsequent quality issues and rework, improving overall process efficiency and product reliability.
Solution Approach 2:
The patent optimizes the surface roughness parameter through blast polishing to achieve both peeling suppression and improved solder wettability. By controlling this single parameter within a specific range, the patent simultaneously addresses multiple quality requirements despite the additional processing step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses peeling of the external electrodes, enhances solder wettability, and ensures high reliability by maintaining a smooth surface for plating layer formation, thereby improving the overall performance and durability of the ceramic electronic component.
Implementation Method 1
performing blast polishing on a composite sintered body including a ceramic body and a pair of base layers
Implementation Method 2
forming a pair of plating layers on the composite sintered body subjected to the blast polishing by a wet plating method
Implementation Method 3
preparing a composite sintered body including a ceramic body and a pair of base layers
Data Source
AI summary
A ceramic electronic component includes: a ceramic body including a pair of end surfaces, and a side surface connecting the pair of end surfaces and including a pair of end regions adjacent to the pair of end surfaces and an intermediate region located between the pair of end regions; and a pair of external electrodes including a pair of base layers that cover the pair of end surfaces and the pair of end regions of the side surface and include outer surfaces, a difference of a surface roughness Ra of the outer surfaces with respect to the intermediate region of the side surface being 40 nm or less, and a pair of plating layers covering the outer surfaces of the pair of base layers and including a pair of extending portions extending from the outer surfaces of the pair of base layers to the intermediate region of the side surface.