Ceramic Electronic Component Outer Electrode Bonding Strength

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Solution Overview

Problem

Ceramic electronic components face challenges in maintaining bonding strength between inner and outer electrodes, especially under mechanical impact and thermal stress, which can lead to detachment and cracking, particularly in harsh environments such as mobile devices and in-vehicle equipment.

Innovation Solution

A ceramic electronic component design featuring a ceramic body with an inner electrode and an outer electrode that includes a resin and metal components, where the outer electrode is formed using a thermosetting conductive paste with a metal filler having a higher melting point, and a connecting portion extending from the outer electrode into the ceramic body, enhancing bonding strength through a specific metal composition and heating process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a conventional firing conductive paste is used to form the outer electrode, then the manufacturing process is simple, but the bonding strength between the inner electrode and outer electrode is insufficient under mechanical impact and thermal stress

Engineering Contradiction:
Improvebonding strength between inner electrode and outer electrodeVSAvoidcomplexity of electrode formation process
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The outer electrode uses a composite structure combining a resin matrix with metal particles (Sn, Ag, Cu) and conductive oxides. This composite material provides both mechanical bonding strength to withstand impact and thermal stress, while maintaining electrical conductivity. The resin matrix binds the metal particles together and to the inner electrode, creating a robust connection that conventional single-material pastes cannot achieve.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention changes the material parameters of the outer electrode by introducing a resin-based composition with specific metal particle size distributions and concentrations. The resin content, metal particle size range, and heating temperature parameters are optimized to achieve maximum bonding strength. This parameter optimization allows the outer electrode to form a strong mechanical and metallurgical bond with the inner electrode, resolving the strength deficiency of conventional pastes.

Inventive Principle:
Principle #35Parameter changes

2Strength

If the outer electrode contains metal powder with low melting point, then the bonding strength is improved, but the component becomes vulnerable to thermal damage

Engineering Contradiction:
Improvebonding strength between inner electrode and outer electrodeVSAvoidthermal resistance of the component
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The outer electrode employs local quality differentiation by incorporating multiple metal components with different melting points in specific proportions. Sn particles (low melting point) provide bonding strength at the interface with the inner electrode, while Ag particles (high melting point) distributed throughout the outer electrode provide thermal resistance. This spatial and functional differentiation allows the same component to simultaneously achieve both bonding strength and thermal stability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The composite material structure combines low-melting-point Sn metal particles for bonding with high-melting-point Ag metal particles for thermal resistance. The resin matrix binds these different metal components together, creating a multi-functional outer electrode that achieves both strong adhesion to the inner electrode and resistance to thermal damage from soldering and operating temperatures.

Inventive Principle:
Principle #40Composite materials

3Strength

If the connecting portion length is increased to improve bonding strength, then the bonding strength increases, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvebonding strength between inner electrode and outer electrodeVSAvoidprecision of connecting portion formation
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The invention optimizes the connecting portion length parameter to a specific range (2.0-5.0 μm) that achieves sufficient bonding strength without excessive precision requirements. This parameter optimization, combined with the resin-based paste formulation and controlled heating process, creates a robust connection that is tolerant to normal manufacturing variations. The connecting portion is formed with controlled metal particle distribution and size to ensure reliable bonding within this optimized length range.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves high bonding strength between the inner and outer electrodes, improving the component's resistance to physical impact and thermal cycles, thereby reducing the likelihood of damage and ensuring reliable mounting.

Implementation Method 1

The electrode layer is heated to form, on the surface of the ceramic body, an outer electrode that contains the resin and the first and second metal components

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 2

The electrode layer is heated to form... an outer electrode that contains the resin and the first and second metal components and that is disposed so as to cover the end portion of the inner electrode and a connecting portion

Methodology Applied
Scientific EffectSintering: Sintering

Implementation Method 3

an outer electrode that is formed using a thermosetting conductive paste

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS11017950B2Method for producing a ceramic electronic component
Publication Date: 2021.05.25 MURATA MFG CO LTD
  • US11017950B2 patent drawing
  • US11017950B2 patent drawing
  • US11017950B2 patent drawing

AI summary

A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.