Ceramic Chip Electrode Plating for Corner Pinhole Prevention
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Solution Overview
Problem
The existing technologies for chip-type ceramic electronic components face issues with pinholes in the plating layer, particularly at the corners of the ceramic body, leading to weak bonding and potential damage from plating solution infiltration, which compromises the reliability of the electronic component.
Innovation Solution
The electronic component design includes a base layer covering the end surface and side surfaces except for the corner, with a plating layer that has a thickness larger than the center, ensuring the corner is adequately covered to prevent pinholes and gaps, thereby enhancing the bonding force and reducing the risk of plating solution infiltration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the base layer thickness is reduced to increase ceramic body dimensions and internal electrode count, then the external dimensions can be increased and performance improved, but the base layer at corners becomes too thin and corners may be exposed from the base layer
Solution Approach 1:
The patent applies different thickness specifications to different regions of the plating layer. Specifically, the plating layer at corner portions is designed to be thicker than the plating layer at other portions, creating local quality variation that addresses the corner exposure problem while maintaining overall thin base layer design
Solution Approach 2:
The patent performs preliminary protection by ensuring corners are adequately covered with thicker plating layer before the component undergoes subsequent manufacturing steps or usage. This preliminary action prevents corner exposure and potential damage in advance
2Area of stationary object
If plating time is increased to expand plating layer coverage to corner surfaces, then corner coverage is improved, but the plating layer becomes thin with weak bonding force and gaps are likely to be generated
Solution Approach 1:
The patent specifies that the plating layer at corner portions shall have a greater thickness than the plating layer at other portions. This local quality differentiation ensures adequate coverage and bonding strength at corners without requiring uniformly thick plating across the entire component, thus avoiding weak bonding issues
3Productivity
If plating time is insufficient to fully cover corners, then manufacturing efficiency is maintained, but pinholes are generated in the plating layer causing plating solution infiltration
Solution Approach 1:
The patent implements local quality control by specifying minimum thickness requirements for the plating layer at corner portions. This ensures that even with optimized (reduced) plating time, corners receive adequate coverage to prevent pinhole formation and plating solution infiltration, maintaining reliability while improving productivity
Solution Approach 2:
The patent establishes preliminary design criteria requiring thicker plating at corners before the plating process begins. This preliminary action guides the plating process to prioritize corner coverage, ensuring pinhole prevention without requiring excessive plating time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces or prevents the formation of pinholes in the plating layer, improving the reliability and performance of the electronic component by ensuring a stronger bond between the ceramic body and the plating layer, even when the base layer is thinned.
Implementation Method 1
a plating layer covering the base layer and the corner
Data Source
AI summary
An electronic component includes a ceramic body, and an external electrode provided at an end of the ceramic body. Two adjacent side surfaces and an end surface of the ceramic body are in contact with each other to define a corner of the ceramic body, the external electrode includes a base layer covering the end surface and side surfaces including the two adjacent side surfaces except for the corner, and a plating layer covering the base layer and the corner, and the plating layer covering the corner has a thickness larger than a thickness of the plating layer covering a center of the end surface.