Multilayer Ceramic Component Electrodes With Laser-Formed Ceramic Covering
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Solution Overview
Problem
Existing multilayer ceramic electronic components face issues with external electrode separation and reduced adhesive strength when thickness is decreased for size reduction, particularly when underlying electrode layers are formed by sputtering methods, leading to potential rolling up and separation from the ceramic element.
Innovation Solution
A method involving laser irradiation to melt and solidify a ceramic layer over the underlying electrode layer, forming a continuous covering layer that enhances adhesion and prevents separation, combined with a plating layer to improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the thickness of the external electrode is reduced to decrease the height of the multilayer ceramic electronic component, then the height is reduced, but the adhesive strength between the external electrode and the ceramic element decreases, causing the external electrode to separate from the ceramic element
Solution Approach 1:
The patent applies composite materials by combining the underlying electrode layer (formed by sputtering) with a covering layer made of ceramic material. This composite structure maintains adhesion strength even when the overall electrode thickness is reduced, as the ceramic covering layer provides mechanical support and bonding to the ceramic element body.
Solution Approach 2:
The patent changes the physical and chemical parameters of the electrode structure by forming an underlying electrode layer with specific thickness and composition through sputtering, then covering it with a ceramic layer. This parameter optimization allows thin electrodes to maintain sufficient adhesive strength.
2Manufacturing precision
If the underlying electrode layer is formed by sputtering method to make it thinner and more even, then the thickness is reduced and uniformity is improved, but the adhesive strength decreases and the electrode layer readily rolls up from the end part
Solution Approach 1:
The sputtered underlying electrode layer is combined with a ceramic covering layer to form a composite structure. The ceramic covering layer provides mechanical stability and prevents rolling up at the ends, while the sputtered layer provides uniform thickness and good adhesion to the ceramic element body.
Solution Approach 2:
The underlying electrode layer is formed by sputtering first to ensure uniform thickness and good adhesion, then the ceramic covering layer is applied afterward to provide structural stability. This sequential formation prevents rolling up by establishing a stable structure before final assembly.
3Quantity of substance
If the thickness of the ceramic layers and internal electrodes is reduced to increase the number of stacked layers, then the capacitance is maintained while the size is reduced, but the height is decreased which requires thinner external electrodes
Solution Approach 1:
The patent uses composite electrode structures (underlying electrode layer + covering layer) that allow the external electrodes to be thinner while maintaining sufficient strength. This enables the overall component height to be reduced without compromising electrode integrity.
Solution Approach 2:
The external electrode is segmented into multiple functional layers: the underlying electrode layer (for adhesion and conductivity) and the covering layer (for mechanical strength and protection). This segmentation allows each layer to be optimized independently, enabling thinner overall electrodes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents underlying electrode layer rolling and separation, maintaining high adhesion strength and reducing the likelihood of plating layer separation, thus enhancing the reliability of the multilayer ceramic electronic component.
Implementation Method 1
irradiating a vicinity of an underlying electrode layer with a laser for ceramic elements on which underlying electrode layers are formed on upper and lower surfaces to melt a ceramic layer at a surface by a predetermined depth
Implementation Method 2
the ceramic layer at the surface is melted by a predetermined depth and moves toward the underlying electrode layer side and is solidified
Data Source
AI summary
Provided is a multilayer ceramic electronic component including a ceramic element having a multilayer body in which internal electrodes are stacked with interposition of a dielectric layer and the internal electrodes are led out in a direction orthogonal to a stacking direction, and a protective part located at least on upper and lower surfaces of the multilayer body in the stacking direction, an underlying electrode layer formed at least on part of a surface of the protective part on either one or both of upper and lower sides in the stacking direction, a covering layer that covers an end part or a rim part of the underlying electrode layer, a plating layer that covers at least an upper surface of the underlying electrode layer, and at least a pair of external electrodes having the underlying electrode layer and the plating layer and being electrically connected to the internal electrodes.