Multilayer Ceramic Component Electrode Discontinuity Crack Suppression
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Solution Overview
Problem
Multilayer ceramic capacitors with internal electrode layers thinner than 0.5 μm face challenges in suppressing structural defects like cracks and delamination due to limitations in bonding strength and dielectric ceramic layer thickness, as existing methods fail to effectively maintain electrostatic capacitance and mechanical strength at such thin dimensions.
Innovation Solution
A multilayer ceramic electronic component design featuring electrode discontinuity portions with dielectric ceramic particles larger than the dielectric ceramic layer thickness, which contact and bridge internal electrode layers, enhancing bonding strength and suppressing spheronization, thereby reducing cracks and delamination, and improving bending strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of the internal electrode layer is reduced to 0.5 μm or less to increase capacitance, then the electrostatic capacitance is improved, but structural defects such as cracks and delamination occur more frequently
Solution Approach 1:
Dielectric ceramic particles are introduced as intermediary substances within the internal electrode layer. These particles act as mediators that connect and strengthen the bonding between adjacent internal electrode layers, preventing cracks and delamination while allowing the electrode layer thickness to be reduced to 0.5 μm or less.
Solution Approach 2:
The internal electrode layer is transformed from a homogeneous conductive material into a composite structure containing conductive material and dielectric ceramic particles. This composite structure provides both the necessary electrical conductivity and enhanced mechanical strength to prevent structural defects at reduced thickness.
2Quantity of substance
If the thickness of the dielectric ceramic layer is reduced to increase the number of laminated layers, then the electrostatic capacitance is improved, but the bonding strength between layers deteriorates
Solution Approach 1:
Dielectric ceramic particles serve as intermediary substances at the interfaces between dielectric ceramic layers and internal electrode layers. These particles enhance the bonding strength between thin layers, allowing the dielectric ceramic layer thickness to be reduced while maintaining adequate bonding strength.
Data Source
AI summary
The present invention aims to suppress the cracks and delamination to improve the bending strength of multilayer ceramic electronic component with internal electrode layers wherein the thickness of the internal electrode layer is 0.5 μm or less. The multilayer ceramic electronic component is a laminated body having internal electrode layers and dielectric ceramic layers which are laminated alternately. The internal electrode layers have electrode discontinuity portion. In a part of the electrode discontinuity portion, a dielectric ceramic particle bigger than the thickness of the dielectric ceramic layer is contained when the cross section is observed from the direction perpendicular to the laminating plane of the laminated body. The dielectric ceramic particles have the same crystal structure with the dielectric ceramic particles contained in the dielectric ceramic layers, and contact with at least one internal electrode layers which are opposite to each other with dielectric ceramic layers sandwiched therebetween.