Ceramic Electrode Edge Offset for Crack-Resistant Components

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing ceramic electronic components face stress concentration issues due to the alignment of stress loading points from external electrodes, which can lead to cracking, particularly when the distal ends of electrode layers are not properly distributed, causing concentrated stress on the ceramic element body.

Innovation Solution

The design incorporates a configuration where the external electrodes have base layers and plating layers with distinct edge positions, creating steps or inclined surfaces on the ceramic element body, dispersing stress loading points and preventing concentration, thereby reducing the likelihood of cracking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the distal ends of electrode layers are aligned on the same plane, then the electrode structure is simplified, but stress concentrates at the same point on the ceramic element body causing cracking

Engineering Contradiction:
Improveelectrode structure complexityVSAvoidcrack resistance of ceramic element body
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent extends the second electrode layer in the length direction beyond the first electrode layer's distal end, creating a staggered arrangement where stress loading points are separated along the length direction. This dimensional offset prevents stress concentration at a single point on the ceramic element body, resolving the contradiction between structural simplicity and crack resistance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If a resin layer is added between the external electrode and ceramic element body to prevent cracking, then crack resistance improves, but manufacturing complexity increases due to gap formation requirements

Engineering Contradiction:
Improvecrack resistance of ceramic element bodyVSAvoidmanufacturing process simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent removes the resin layer from the structure and instead directly extends the second electrode layer beyond the first electrode layer's distal end. This extraction of the resin layer eliminates the need for gap formation and complex manufacturing processes while maintaining crack resistance through the staggered electrode arrangement.

Inventive Principle:
Principle #2Taking out (Extraction)

3Adaptability or versatility

If external electrodes are formed on multiple surfaces including opposite side surfaces, then electrical connectivity is improved, but stress distribution on the ceramic element body becomes more complex

Engineering Contradiction:
Improveelectrical connectivity of componentVSAvoidstress distribution pattern
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent creates an asymmetric electrode configuration where the second electrode layer extends beyond the first electrode layer's distal end in the length direction. This asymmetric design provides improved electrical connectivity while establishing a predictable, non-uniform stress distribution pattern that avoids stress concentration, resolving the contradiction between connectivity and stress distribution complexity.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS11776756B2Ceramic electronic component, substrate arrangement and method of manufacturing ceramic electronic component
Publication Date: 2023.10.03 TAIYO YUDEN KK
  • US11776756B2 patent drawing
  • US11776756B2 patent drawing
  • US11776756B2 patent drawing

AI summary

A ceramic electronic component includes an element body, and first and second external electrodes formed on the element body. The element body has a dielectric, and first and second internal electrodes. The first external electrode includes a first base layer formed on the element body. The first base layer is connected to the first internal electrode and an edge of the first baser layer is present on a first surface of the element body. The first external electrode also includes a first plating layer formed on the first base layer. An edge of the first plating layer is present on the first surface of the element body at a position different from a position of the edge of the first base layer in a direction perpendicular to the first surface. The second external electrode has a similar structure to the first external electrode.