Multilayer Ceramic Component External Electrode Segmentation
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Solution Overview
Problem
Conventional multilayer ceramic electronic components face challenges in achieving optimal adhesiveness, sealing, copper wettability, acid resistance, and capacitance contactability due to the high-temperature characteristics of glass in external electrode pastes, which hinder the precise placement of different types of glass required for desired functions.
Innovation Solution
A multilayer ceramic electronic component design featuring a ceramic body with dielectric layers and internal electrodes, where the external electrodes consist of a first electrode layer with a conductive metal and glass, and a second electrode layer with a different conductive metal, with the second electrode layer having a reduced glass content and being shorter in length than the first, to improve reliability and hermetic sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single type of glass or two or three types of glass are included in external electrode paste to achieve desired functions (adhesiveness, sealing, copper wettability, acid resistance), then the respective functions can be satisfied, but the high-temperature characteristics of glass make it difficult to locate the glass in desired positions in external electrodes
Solution Approach 1:
The external electrode is divided into two distinct layers: a first external electrode layer containing glass for sealing and adhesiveness, and a second external electrode layer containing conductive metal for electrical connectivity. This segmentation allows each layer to be optimized for its specific function without interference from the other materials.
Solution Approach 2:
The glass component is extracted from the conventional single-layer external electrode structure and placed exclusively in the first external electrode layer. This extraction enables precise control over glass positioning and distribution, eliminating the manufacturing precision issues associated with trying to position multiple glass types in a single layer.
2Volume of moving object
If external electrodes are thinned to achieve miniaturization, then small size is achieved, but the reliability and hermetic sealing properties may be compromised
Solution Approach 1:
The external electrode is constructed as a composite structure with a first layer containing glass and conductive metal for sealing and adhesiveness, and a second layer containing conductive metal for electrical connectivity. This composite structure maintains hermetic sealing properties even when the overall electrode thickness is reduced for miniaturization.
Solution Approach 2:
The first external electrode layer is specifically designed with glass content to provide hermetic sealing at critical interfaces, while the second layer is optimized for electrical conductivity. This local quality differentiation ensures that sealing functions are maintained even when overall electrode dimensions are reduced.
3Ease of manufacture
If conventional single-layer external electrode structure is used, then manufacturing is simpler, but it cannot simultaneously satisfy multiple requirements (adhesiveness, sealing, copper wettability, acid resistance)
Solution Approach 1:
The external electrode formation process is segmented into two sequential steps: first forming a layer with glass for sealing and adhesiveness, then forming a second layer for electrical conductivity. While this adds a step, each step can be optimized independently, and the overall process remains manageable through standard multi-layer electrode formation techniques.
Solution Approach 2:
The first external electrode layer serves multiple functions simultaneously: it provides hermetic sealing through glass, adhesiveness to the ceramic body, and copper wettability for electrical connectivity. This multi-functionality in the first layer reduces the need for additional specialized materials or processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and miniaturization of multilayer ceramic components by ensuring improved adhesion, sealing, and resistance to plating solutions, preventing reliability degradation caused by moisture and acid corrosion.
Implementation Method 1
The glass fills a void, which is not filled with a copper metal, to achieve complete hermetic sealing
Implementation Method 2
The external paste also contains a glass as an auxiliary material to provide adhesive strength between the external electrodes and the chip
Implementation Method 3
The glass fills a void, which is not filled with a copper metal, to achieve complete hermetic sealing
Data Source
AI summary
A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and a first internal electrode and a second internal electrode disposed in a stacking direction to face each other with the dielectric layer interposed therebetween; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode. Where a length of the first electrode layer in a length direction of the ceramic body is denoted by A and a length of the second electrode layer in a length direction of the ceramic body is denoted by B, B is shorter than A.